July 19, 2007 — SUSS MicroTec, has launched its new 300mm SOI wafer bonding system, ELAN CBC300SOI. The new release represents the most recent addition to SUSS’s wafer bonder product portfolio. SUSS says it has already shipped its new 300mm SOI wafer bonding system to a leading manufacturer of silicon-on-insulator (SOI) wafers.

According to SUSS, the new system boasts significant throughput and cost-of-ownership improvements over what is currently available. “Today, wafer bonding is clearly the most critical step in the production of SOI wafers and the ELAN CBC300SOI meets the challenges of this rapidly expanding market,” said Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec.

The new system incorporates patented single-station bond technology, which enables 300mm cleaning, aligning, and bonding in a single process module and thus eliminates wafer handling between each step to improve cleanliness and productivity. In addition, advanced cleaning technologies promise void-free bonding. SUSS’ unibody dual-nozzle megasonic cleaner and programmable IR-assisted spin drying enable extremely clean wafers and controlled surface drying. Within SUSS’s patented single-station bond module, infrared heating of wafers means customers can now control their clean and dry parameters very specifically.

The standard ELAN SOI system includes two single station bond modules, a high-resolution IR inspection module, a central Material Handling Unit (MHU) with a wafer handling robot and pre-aligner, and two FOUP loadports – all in a small package.