Takatori’s ATM-1100EF wafer protective tape-laminating machine is designed for MEMS applications. (Image: GTI)

Apr. 16, 2007 — Capital equipment distributor GTI Technologies has announced the North American availability of what it calls “a new generation of wafer-taping machinery.” The ATM-1100EF, manufactured by Takatori Corporation of Japan, expands upon Takatori’s ATM-1100 wafer protective tape-laminating machine by adding the capability to handle MEMS applications. Direct benefits include the increased control of film thickness and temperature throughout the laminating process — controls GTI says are critical to cost-effective wafer production.

The machine can accommodate any film, regardless of its consistency or thickness (from 15-200 microns). And, it has temperature-control features built into the lamination roller, knife blades and table itself, which can be uniformly heated, even in ambient conditions of as much as of 200˚C (392˚F) allowing for temperature sensitive process.

Unlike resist spin-coating and other similar processes, the ATM-1100EF generates no chemical waste, so it promises to not only reduce hazardous waste disposal but also to lower overall fabrication costs. Available options include a no-tension lamination system for specific applications; an ESD-handling system that substitutes for a vacuum for a wafer with holes; a knife-cleaning system to remove any residue, insuring optimal performance; and a touch-panel screen with a 50-segment pressure control.