GenISys announces enhanced layout beamer for e-beam lithography

Nov. 9, 2006 — GenISys GmbH, a Munich, Germany, provider of software solutions for efficient processing of large layout data and optimization of microstructure fabrication, announced Layout BEAMER 2.0.

The package is designed to be a high-performance yet easy-to-use data preparation solution that combines the robust layout processing of GenISys’ Layout ENGINE with powerful proximity effect correction (PEC) and the ease of the VisualFLOW platform in one package.

At the heart of Layout BEAMER 2.0 is GenISys’ high-performance layout processing tool-kit, Layout ENGINE, which is incorporated in several equipment manufacturer systems. (Carl Zeiss has incorporated the Layout ENGINE of GenISys in their mask repair system.)

Layout BEAMER 2.0 is intended to close the full layout processing chain from the design data in all major formats to writing on the major e-Beam machines such as Vistec, JEOL and Raith by “fracturing” to the desired machine formats. Its ability to handle a large volume of layout data quickly is coupled with VisualFLOW’s user-friendly, drag-and-drop interface, which enables users to easily design complex, hierarchical process flows and to define and save them as custom modules.

Layout BEAMER 2.0 users can also define design parameters as variables and vary them in loops, which in turn provides strong automation and optimization abilities. They can then save these customized modules and flows to construct a “corporate knowledge base.”

PEC is a critical step in obtaining reliable, repeatable beam writer performance and superior critical dimension control on advanced circuit patterns. The state-of-the-art PEC found in Layout BEAMER is further enhanced in Version 2.0 for use in measured or calculated tables, in addition to multi-Gaussian correction.

In the face of rising costs for mask-making and conventional lithography, direct-write technology is becoming more and more attractive for device development, prototyping and small-volume fabrication for both device manufacturers and researchers.

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