ECSI announces new bench-top electroplater

July 20, 2006 — ElectroChemical Systems Inc. (ECSI), a Denville, N.J., maker of wet processing equipment for MEMS and other markets, announced a new version of its IKo bench-top electroplater.

The company says its IKo-2W6 bench-top electroplater allows simultaneous processing of multiple two-inch to eight-inch wafers. The machine is capable of electroplating and electroforming two wafers in the same plating solution, with the same or different operating parameters, if needed.

It is intended to be a tool for fast R&D and/or small scale production. The first sale of the machine went to a major supplier of specialty chemicals for electronics and MEMS manufacturers.

In addition, ECSI said it has sold its IKo Classic equipment in Italy, Belgium, Finland and Korea. The system is designed to enable an operator with limited electroplating skills to reliably achieve reproducible results.

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