Aug. 10, 2005 — DALSA Corp. and Xerox Corp. have agreed to collaborate in MEMS technology development.
The companies say the relationship will combine Xerox’s expertise in MEMS microsystem design with DALSA’s advanced MEMS and high-voltage device manufacturing technologies.
Steven Bolte, vice president and manager of the Xerox Wilson Center for Research and Technology in Rochester, N.Y., said in a prepared statement that Xerox chose Dalsa because it needed a supplier that could integrate MEMS and high voltage CMOS, and that could also do wafer level packaging.
The companies have been working together for nine months on prototype experiments, though they did not disclose the class of products on which they are working.