Nov. 30, 2005 — NanoDynamics Inc. of Buffalo, N.Y., and ALD NanoSolutions of Broomfield, Colo., announced a partnership to develop coatings for electronics applications.
NanoDynamics says that — using ALD’s atomic layer deposition technology — it has developed a new manufacturing approach to creating uniform, nanometer thick coatings that encapsulate powders along with other elements, enabling them to retain inherent thermal and conductive properties while eliminating reactivity and functionality issues.