September 30, 2008: memsstar Technology , a supplier of etch and deposition equipment to the global MEMS industry, announced the successful installation and process qualification of one of its sacrificial vapor release (SVR) etch systems.

As part of a further expansion of advanced capabilities for microsystems, Fraunhofer IMS has selected and installed the latest memsstar SVR system, to be used in the latest MEMS devices for advanced isotropic etch “release” schemes. The system will be used across a range of devices, materials and designs, and will be integrated with other process steps to offer complete process modules.

“We selected memsstar SVR to get the best MEMS etch process capabilities as well as excellent process control and repeatability,” said Professor Holger Vogt from Fraunhofer IMS.

“The MEMS industry increasingly requires innovative research and manufacturing equipment solutions for release etching and coating, which were not available before memsstar,” stated Mike Leavy, CEO and co-founder of memsstar. “Europe is a world leader in the development of advanced MEMS technology and we are proud to be working with the Fraunhofer Institute on this project.”

Memsstar uses vapor phase single wafer processing for the release etch and surface modification process steps as required in most MEMS devices. With unique CCFT process control technology and an extensive range of chemistries, users get a wide process window and integrated process controls which far exceed other currently available systems and methods. Memsstar systems deliver fast throughput, small footprint, low consumption and emissions, scalable platforms, process controls and high repeatability at a low entry-level cost.

Silicon probes left pristine after release etch on SVR-XE. (Source: memsstar Technology