April 25, 2012 – PRNewswire — Silex Microsystems, a pure-play micro electro mechanical system (MEMS) foundry, will develop ferromagnetic materials for next-generation MEMS devices, under a new VINNOVA research grant worth nearly 3 million Swedish Kronor (about US$445,632). The aim is improved smartphones with multi-axis sensor integration.

Magnetic MEMS enable multi-axis sensor integration, said Dr Thorbjorn Ebefors, chief technologist at Silex Microsystems. Multi-axis sensors combine magnetic sensing with gyroscope functions, creating sensors with multiple degrees of freedom, added Ebefors.

Combining Silex’s Met-Via through-silicon via (TSV) technology with magnetic materials could create high-value, high-Q integrated inductors, leading to high-quality integrated passive devices (IPD) and Functional Capping technologies. Silex is also engaging in research with its Met-Via TSVs combined with mold packaging for semiconductor devices.

The magnetic MEMS technology development program will begin in May 2012 and will run for 18 months, with an end goal of prototyping runs.

The award, under VINNOVA’s R&D programs titled "Forska & Vax," was one of 63 programs granted, out of more than 340 proposals received. In total, VINNOVA grants totaled approximately 68 million Swedish Kronor for R&D programs.

VINNOVA, the Swedish Governmental Agency for Innovation Systems, supports programs for R&D projects in small companies and at universities to long-term development of strong research and innovation environments that attract R&D investment and expertise from around the world. The aim of VINNOVA’s funding is to enable small and medium-sized enterprises to increase their competitiveness by investing in research and development, thus contributing to growth in Sweden. For more information, see www.vinnova.se/en.

Silex Microsystems is a pure-play MEMS foundry. Internet: www.silexmicrosystems.com.

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