United Microelectronics Corporation, a global semiconductor foundry, and Lantiq, a supplier of broadband access and home networking technologies, today announced that UMC has entered volume production for Lantiq’s SPT170 high voltage Power Management ICs (PMIC) used for landline applications. The SPT170 offers the industry’s highest breakdown voltage of all subscriber line interface circuit (SLIC) technologies used in the market, incorporating a custom 2.0um process developed by Infineon Technologies that can handle voltages of up to 170 volts. This high voltage durability provides a robust and reliable interface solution for landlines, which face notoriously harsh environments that include lightning strikes and unintended power contact to the line.

J H Shyu, senior vice president of Production and Operation Integration at UMC said, “Although UMC has been an integral player in the mobile communication revolution, we are also addressing the requirements of landlines, which remain the practical choice for use in homes, offices and institutions. With over 1 billion landlines in operation across the globe, we are happy to address this market with UMC’s volume production of Lantiq’s SPT170 ICs. We look forward to bringing Lantiq’s other products to fruition in the near future.”

Dominik Bilo, COO of Lantiq, “With the delivery of highest quality semiconductor production and excellence in leading-edge processes, UMC is an extremely valuable partner for our manufacturing strategy. We rely on their high-tech expertise and proven processes. With the successful transfer of our SPT170 technology, we ensure consistent production of our mature and field proven voice solutions for many years to come – standing firm behind our product roadmap.”