The 2015 market for dielectric precursors is expected to total $230M, of which over $45M is attributed to low-κ dielectrics, according to a new report from Techcet Group, “2015 Techcet Critical Materials Report on Advanced Insulating Dielectric Precursors.” The outlook is for 8.5% growth to ~$250M in 2016, continuing to almost $300M by 2020 for a 5-year CAGR of 5.1%.
With 3D structures displacing planar 2D transistors in leading edge nodes, the call for new dielectric materials and deposition processes has continued to fragment. Device films require extreme conformality, precision uniformity in atomic layer thicknesses, and aspect ratio fills of 70:1 or more at deposition temperatures below 200°C. Masking films and sacrificial layers have to meet exacting specifications for removal selectivity, edge definition and etch resistance.
Techcet’s 2015 Dielectric Precursors Report provides strategic information on the dielectrics market including revenue by precursor type/application and market share ranking. It also includes critical information used to ensure business continuity and support category management of the CVD, ALD, and SOD dielectric markets and their supply chains. In addition to business and technology trends, supply chain and geopolitical issues that impact dielectric precursors are also discussed in this year’s report.