Novel, chemically precipitated sub-micron silver materials from Ames Goldsmith Corporation will be introduced Nov. 18 at Printed Electronics 2015 in Hall C, Booth R20. This proprietary technology platform enables fine-line flexible circuits, allowing product designers more versatility and greater freedom to incorporate electronics into broader applications than previously possible to expand commercialization of advanced technologies such as flexible displays and printed, flexible circuits.

Average particle sizes range between 200–400 nanometers. Ames controls particle synthesis of the sub-micron silver material via chemical precipitation, which allows its surface chemistry to be tailored to match customers’ needs to optimize specific ink systems. This produces conductive inks, pastes, and adhesives with controlled rheology and viscosity for finer and sharper line definition.

Ames Goldsmith controls synthesis of its proprietary sub-micron Ag material via chemical precipitation to produce well-defined, uniform spherical particles to customers’ targeted size and morphology with very tight distribution. Average particle sizes range between 200–400nm, with specific surface area > 1.5 m2/g and tapped density > 3.5g/cm3. The spherical sub-micron material are compatible with many solvents.

The new sub-micron silver materials offer cost-efficient performance and are commercially available in high-volume quantities.

Ames Goldsmith is a supplier of silver-based, gold, platinum, palladium and copper products to the global printed electronics, EO catalyst refining, photographic, and health care industries. Ames Goldsmith and Ames Advanced Materials Corporation develop next generation metal products for the electronics industry. The company’s Catalyst Refiners, Inc. subsidiary provides a variety of silver oxide and refining services on a global basis.