Contributing editor and blogger Phil Garrou received the 3D InCites “Device of the Year” award during the 2016 SEMICON West conference for “Excellence in 3D Packaging Technologies.” The awards were a result of industry voting for individuals, companies and products exhibiting excellence in 3D packaging expertise and contributing to the commercialization of game-changing technologies such as: fan-out wafer level packaging (FOWLP), interposer-based packages, 3D stacks and 3D System-in-Package (SiP).

• Since his retirement from Dow Chemical in 2004, Dr. Garrou has provided information as a consultant, expert witness and reporter on high end packaging with a focus on 2.5 / 3D Integration.
• His weekly Solid State Technology packaging blog “Insights From the Leading Edge” (IFTLE) is now approaching its 300th post.
• He has written 130 articles for Yole Developpement’s iMicronews that took “A Closer Look” at advanced packaging technologies focusing on 3DIC.
• He co-edited Vol. 1-3 of the Wiley VCH series “Handbook of 3D Integration” in 2008 and 2014 and co-edited the first MRS Proceedings on 3DIC (2006 & 2008).
• Garrou helped create and chaired the 1^st and 4^th “IEEE 3D System Integration Conference” that is now entering its 7^th year and has been Technical Chair of the RTI “3D Architectures for Semiconductor Integration & Packaging” Conference (3D ASIP) for the past 9 years.

Phil Garrou accepts the award for “Excellence in 3D Packaging Technologies” from 3D InCites Francoise von Trapp.