BY PETE SINGER, Editor-in-Chief

I never thought it would happen, but it’s officially the end of the road for The International Technology Roadmap for Semiconductor (ITRS). A final report is coming, but the Semiconductor Industry Association has informed roadmap participant that there will be no funding for ITRS roadmapping efforts moving forward.

Signs of the end were evident last year, when the focus of the ITRS was dramatically changed with a new goal. Instead of being primarily focused on manufacturing challenges that needed to be overcome to enjoy the benefits of continued scaling, the focus in the relabeled “ITRS 2.0” was to start with a system level approach and then figure out what was required at the chip and transistor level.

The good news is that a new roadmap, led by long-time chief ITRS roadmapper Paolo Gargini is underway, sponsored by IEEE, the Institute of Electrical and Electronic Engineers. With the launch of the IRDS program, IEEE is taking the lead in building a comprehensive, end-to-end view of the computing ecosystem, including devices, components, systems, archi- tecture, and software. The Methods of governance, reports, and strategic roadmaps developed by the ITRS and ITRS 2.0 will inform the IRDS within the IEEE-SA IC program.

“Over the past decade, the structure and requirements of the electronics industry have evolved well beyond the semiconductor’s industry requirements. In line with the changes in the new electronics ecosystem, the IRDS will build upon the past groundwork and move up a level to identify challenges and include recommendations on possible solutions,” said Paolo A. Gargini, IEEE Fellow and chairman, of IRDS. “The IRDS will deliver a 15-year vision that encompasses systems and devices, setting a new direction for the future of the semiconductor, communications, IoE and computer industries.”

Participants in the IRDS convened last month at imec in Leuven, Belgium. Over the course of the two-day workshop, the group reviewed the roadmap activities of the Focus Teams (FT) and of the International Technology Working Groups (ITWG) and lay out plans for additional activities in 2016. Some of the fields of discussion include System Integration, Heterogeneous Integration, Connectivity, Future IC Devices and Factory Integration. White papers will be coming soon, and the first report will be out in a year.