Invensas, a wholly owned subsidiary of Xperi Corporation (“Xperi”) (NASDAQ:XPER), today announced the successful technology transfer of its Direct Bond Interconnect to Teledyne DALSA, a Teledyne Technologies company. This capability enables Teledyne DALSA to deliver next-generation MEMS and image sensor solutions that are more compact and higher performance to customers in the automotive, IoT and consumer electronics markets. Teledyne DALSA is a developer of high performance digital imaging and semiconductors and one of the world’s foremost pure-play MEMS foundries. Invensas and Teledyne DALSA announced the signing of a development license in February 2017.

“In partnership with Invensas, we have successfully completed the transfer of its revolutionary DBI technology to our manufacturing facilities in Bromont,” said Edwin Roks, president of Teledyne DALSA. “We are now ready to offer this enabling platform as part of our foundry services to customers, including our own business lines, seeking smaller, higher performance and more reliable MEMS and imaging solutions.”

“The manufacturing team at Teledyne DALSA has done a fantastic job bringing up our DBI process and is well-positioned to enable a new generation of high performance MEMS and image sensor solutions,” said Craig Mitchell, president of Invensas. “We are excited about the prospects for DBI to be integrated into a wide range of Teledyne DALSA’s branded products as well as those of their foundry customers.”

DBI technology is a low-temperature hybrid wafer bonding solution that allows wafers to be bonded with scalable fine pitch 3D electrical interconnect without requiring bond pressure. The technology is applicable to a wide range of semiconductor devices including MEMS, image sensors, RF front ends and stacked memory. DBI 3D interconnect can eliminate the need for through-silicon vias (TSVs) and reduce die size and cost while enabling pixel level interconnect for future generations of image sensors.