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IDT and Telink Semiconductor announce partnership on integrated sensor platforms

02/08/2019  Leveraging respective leadership technologies in sensors and IoT connectivity, Integrated Device Technology, Inc. (IDT) and Telink Semiconductor are announcing a partnership to create connected and integrated sensor platforms for IoT applications.

ePaper 2.0: Color and video come to electronic paper

02/08/2019  With over 25 years of experience in the technology industry, Sri Peruvemba, CMO of CLEARink Displays, is a longtime advocate of electronic display technology.

Record revenues for critical subsystems suppliers in 2018 despite collapse in orders

02/08/2019  Critical subsystems for the IC equipment market continued to grow to a new record of $11 billion in 2018. While 2019 is expected to be a downturn year, the long-term outlook remains unchanged with an average growth rate of 3 percent.

Governor Cuomo announces IBM investment to create artificial intelligence hardware center at SUNY Poly Albany campus

02/07/2019  Governor Andrew M. Cuomo today announced that IBM, a long-time anchor tenant at the SUNY Polytechnic Institute campus in Albany, plans to invest over $2 billion to grow its high-tech footprint at the campus and throughout New York State.

First transport measurements reveal intriguing properties of germanene

02/07/2019  Germanene is a 2D material that derives from germanium and is related to graphene. As it is not stable outside the vacuum chambers in which is it produced, no real measurements of its electronic properties have been made. Scientists led by Prof. Justin Ye of the University of Groningen have now managed to produce devices with stable germanene.

STMicroelectronics to acquire majority stake in silicon carbide wafer manufacturer Norstel AB

02/07/2019  STMicroelectronics today announced it has signed an agreement to acquire a majority stake in Swedish silicon carbide (SiC) wafer manufacturer Norstel AB.

Graphcore leverages Mentor DFT solutions to speed time to market for innovative AI acceleration chip

02/06/2019  Mentor, a Siemens business, today announced that artificial intelligence (AI) semiconductor innovator Graphcore (Bristol, U.K.) successfully met its silicon test requirements and achieved rapid test bring-up on its Colossus Intelligence Processing Unit (IPU) by using Mentor's Tessent product family.

CEA-Leti combines integrated optics and holography in novel, lens-free augmented reality technology

02/06/2019  Leti, an institute of CEA-Tech, has developed a novel retinal-projection concept for augmented reality (AR) uses based on a combination of integrated optics and holography.

Physicists take big step in nanolaser design

02/06/2019  Nanolasers have recently emerged as a new class of light sources that have a size of only a few millionths of a meter and unique properties remarkably different from those of macroscopic lasers.

John Chong of Kionix named Chair of MEMS & Sensors Industry Group governing council

02/06/2019  SEMI today announced the appointment of John Chong, vice president of product and business development at MEMS manufacturer Kionix, as Governing Council chair of the SEMI-MEMS & Sensors Industry Group.

MEMS & Sensors Technical Congress highlights automotive market, emerging MEMS technologies

02/06/2019  This yearÂ’s MEMS & Sensors Technical Congress(MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an exploration of integration standards.

AIM Photonics announces 300mm silicon photonics multi-project wafer performance

02/05/2019  The American Institute for Manufacturing Integrated Photonics (AIM Photonics) today announced a number of technical updates leading to best-in-class 300mm silicon (Si) photonics-based multi-project wafer (MPW) performance for the Department of Defense-sponsored initiative led by SUNY Polytechnic Institute (SUNY Poly).

Researchers report advances in stretchable semiconductors, integrated electronics

02/05/2019  Researchers from the University of Houston have reported significant advances in stretchable electronics, moving the field closer to commercialization.

CEA-Leti builds prototype of next-generation mid-infrared optical sensors for portable device

02/05/2019  CEA-Leti today announced it has prototyped a next-generation optical chemical sensor using mid-infrared silicon photonics that can be integrated in smartphones and other portable devices.

UC Riverside physicists create exotic electron liquid

02/04/2019  The first production of an electron liquid at room temperature opens the way for new optoelectronic devices and basic physics studies.

Mark Majewski named new intelliFLEX CEO

02/04/2019  Electronics industry veteran succeeds founding CEO Peter Kallai as organization shifts head office from Ottawa to GTA.

SEMI-FlexTech issues 2019 request for proposals to advance flexible electronics ecosystem 

02/04/2019  SEMI-FlexTech, an industry-led, public/private partnership, today issued a Request for Proposals (RFP) for artificial intelligence (AI), Human-Machine Interface (HMI), sensor system and other projects to advance the flexible hybrid electronics (FHE) ecosystem.

KLA-Tencor appoints Victor Peng to Board of Directors

02/01/2019  KLA Corporation today announced the appointment of Victor Peng to its board of directors.

Mobile Semiconductor introduces a new 55nm high density memory compiler especially designed for IoT devices

02/01/2019  Mobile Semiconductor announced a new 55nm HD (High Density) memory compiler targeted at the cost sensitive IoT market.

Laser-fabricated crystals in glass are ferroelectric

02/01/2019  For the first time, a team of researchers has demonstrated that laser-generated crystals confined in glass retain controllable ferroelectric properties, key to creating faster, more efficient optical communication systems.