Issue



Electroplating Technology


02/01/2000







Through the use of patented electroplating technology, Unitive Electronics has announced the ability to produce a wide array of bump sizes and pitches for wafer bumping. Bumps ranging from 20 to 800 µms reportedly can be generated, with densities as high as 20 µm bumps on a 50 µm pitch. The process is based on patented Intermetallic Compound Patterning wafer bumping technology, which uses certain metals in the under-bump metallurgy to form intermetallic compounds with liquid solder. These metals are said to ensure that the base of the solder bump consists primarily of an intermetallic compound that resists the acids used to etch away the unwanted metals and prevents etching under the solder bump.

Unitive Electronics Inc.

Research Triangle Park, N.C.