LSI Logic licenses flip chip technology to AIT

12/01/2001

Milipitas, Calif. - LSI Logic Corp. and Advanced Interconnect Technologies have signed a licensing agreement under which AIT will license LSI Logic's organic laminate flip chip FPBGA technology. This packaging technology is designed for use in broadband, networking, computing and storage applications. The agreement provides AIT access to FPBGA-4L (four layer), FPBGA-HP (high performance) and flxI/O flip chip packaging technologies. The agreement also includes assembly processes and materials for the manufacture and qualification of each package type, the use of LSI Logic's standard package offerings and the characterization data of standard packages.