Issue



Briefly speaking


02/01/2001







ASE opens industrial park in Taiwan

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Advanced Semiconductor Engineering Inc. (ASE) has opened its Chungli Intelligent Industrial Park, which combines the services of a group of ASE companies. The new park brings together front-end testing and wafer probing by ASE Test, packaging substrates by ASE Material, packaging services by ASE, and system assembly by Universal Scientific Industrial. It is located on approximately 700,000 square feet of land; construction commenced in 1999 with a plan to complete construction by 2005. Upon completion, the combined facilities will offer more than 6 million square feet of factory space and is expected to create approximately 20,000 new job opportunities.

New drying technology patent

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Austin American Technology Inc. has received a U.S. patent for its drying technology used in the company's Hydrojet In-line series of aqueous and semi-aqueous cleaners. The patent is for both the drying device and for the method used with the device in manufacture. The Hydrojet In-line consists of a pre-wash stage, wash, chemical isolation, multi-stage ringing and drying. Foreign patents are pending.

CR Technology expands headquarters

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CR Technology, a wholly owned subsidiary of Photon Dynamics, has expanded its worldwide headquarters by 30 percent to meet the demand for vision and X-ray inspection systems. The new 26,000 square-foot facility accommodates the company's sales generated by the printed circuit board assembly and semiconductor packaging industries. The additional square footage will be used to expand all departments. The company also anticipates increasing its workforce by more than 40 percent in future months.

No-flow underfill technology study

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Asymtek and the Rochester Institute of Technology (Rochester, N.Y.) have entered into joint research on the material-machine interactions of commercially available no-flow underfill materials. Through its research, RIT plans to develop practical processing parameters and measure the efficacy of different methods of application of no-flow underfill. The study will compare non-contact jetting and traditional contract needle dispensing.

ISO 9001 for Cool Polymers

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Cool Polymers, a manufacturer of thermally conductive polymers and composite thermal solutions, has earned ISO 9001 registration. The company designs and manufacturers polymers that offer good thermal conductivity over standard plastics as well as thin-walled, injection-molded composites that replace metallic and ceramic designs.

New Singapore office for ASAT

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ASAT Ltd. and ASAT Inc. have opened a Singapore office to serve their expanding U.S. and locally based regional customers. Douglas Tam will oversee the office, which is located at 175A Bencoolean Street, #10-12, Burlington Square, Singapore 189650; Tel: 65-238-0188. ASAT provides turnkey solutions in IC package design, assembly and test.

GPD forms alliance with T&M Sales

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GPD, a division of LIFT Industries, recently announced an alliance with T&M Sales (Ellicott City, Md.) for sales representation in Maryland, Washington, D.C., and Virginia. GPD offers manufacturing solutions in equipment and supplies for circuit board assembly and semiconductor packaging.