New Products
11/01/2002
Wafer Defect Inspection System
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NSX-105 wafer defect inspection system is for high-volume wafer manufacturing environments requiring 100 percent micro defect inspection. With a throughput up to 120 wafers per hour (200 mm), the system is said to automatically inspect for visual defects down to 0.5 µm. August Technology, Minneapolis, Minn. For free data, circle 213 or visit www.onlinecenter.to/ap.
Bond Tester
DAGE-4300 is a semiautomatic bond tester for bump shearing 300 mm wafers. In operation, 300 mm wafers can be loaded into the bond tester from a customer's wafer handling robot, or alternatively manually placed into a protective frame. After a semiautomatic alignment onto the X/Y stage, the operator can initiate a fully automated bump shear test routine and also is given precision joystick-controlled motorized access to the entire 300 mm diameter wafer surface. Dage Precision Industries Inc., Fremont, Calif. For free data, circle 217 or visit www.onlinecenter.to/ap.
Reflow Ovens
The Paragon Series of convection reflow ovens are configured for semiconductor packaging applications by featuring a 14'' width conveyor and a 1'' product clearance option. To support lead-free and high-lead solder applications, the series has a maximum temperature rating of 400°C, and is said to maintain its thermal uniformity at high throughput. BTU International, North Billerica, Mass. For free data, circle 205 or visit www.onlinecenter.to/ap.
Die-attach System
Alphasem Easyline 8032 die-attach system handles all metallic lead frame applications with a throughput up to 9,000 UPH and a die placement accuracy of ±38 µm. On a footprint of 1 m2, the platform offers an independently programmable, closed-loop pick-and-bond cycle. Alphasem AG, Andhauserstrasse, Switzerland. For free data, circle 209 or visit www.onlinecenter.to/ap.
Wafer Inspection System
A new option has been added to the WS-series wafer inspection systems that will deliver defect inspection speeds up to 60 wafers per hour for surface defect inspection, and 20 wafers per hour for 3-D inspection of 200 mm wafers. The series of systems combines 2-D defect inspection and accurate height metrology for 100 percent inspection of bumped wafers without sacrificing speed or accuracy. RVSI, Canton, Mass. For free data, circle 211 or visit www.onlinecenter.to/ap.
Mask Aligner
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MA300 Plus mask aligner is capable of processing wafers with diameters up to 300 mm and offers a throughput of more than 100 wafers per hour and high reliability. The layout of the ..tools also allows efficient and easy switches between 200 and 300 mm wafer processing. SUSS MicroTec, Munich, Germany. For free data, circle 204 or visit www.onlinecenter.to/ap.
Laser Wafer Marking System
WaferMark SigmaClean 300 FOUP reportedly uses laser technology to place permanent, highly readable marks on wafers to allow wafer traceability through the semiconductor processes. The system also provides the compatibility, cleanliness levels, mark quality and reliability required to support high-volume 300 mm production. GSI Lumonics, Wilmington, Mass. For free data, circle 214 or visit www.onlinecenter.to/ap.
Enhanced Packages
Enhanced Ball Grid Array Multi-Tier (EBGA-M) is a new version of the EBGA package. The enhanced package is built with multiple wire bonding zones for power, ground and signal connection. Providing up to eight substrate layers in a die-down architecture, the package is said to offer good electrical and thermal performance. ST Assembly Test Services Ltd. (STATS), Singapore. For free data, circle 216 or visit www.onlinecenter.to/ap.