Consolidation Among Taiwan's Subcontractors

10/01/2002

HSINCHU and KAOHSIUNG, TAIWAN — Chipbond Technology Corp. and Fupo Electronics Corp., two Taiwan-based packaging subcontractors, will merge. The resulting company will keep the Chipbond Technology name.

Both companies originally were founded as wafer bumping houses, and they were the only independent companies in Taiwan to develop bumping technology without transferring it from outside sources. They also had both moved into assembly and test of LCD driver ICs, including technologies such as chip-on-glass (COG).

In another move reflecting industry consolidation, the Walsin Lihwa Corp. merged two of its semiconductor group companies. Walsin Advanced Electronics and Walton Advanced Engineering will be combined to focus on memory packaging and testing services. The resulting organization will be named Walton Advanced Engineering.