Advanpack Announces Fine-Pitch Lead-free Bumping

10/01/2002

SINGAPORE — Advanpack Solutions PTE Ltd. (APS), a packaging developer and contract wafer bumper, announced a new capability to meet the legislative restrictions imposed by the European Commission that require lead-free electronics packaging by January 1, 2006. In addition to the lead-free initiative, a concerted effort was put forth to provide a lead-free solution with a bump pitch below 100 µm.

The APS copper pillar bump technology uses a rigid non-reflowable bump to support the reflowable solder wetting tip. Special manufacturing methods restrict solder wetting to the sides of the copper pillar, thereby maintaining a constant spacing of the reflowable portion of the bumps from each other.

In conventional, fully reflowable solder bumping, the bump will change shape and be more prone to flowing or moving during the liquid phase of reflow. The technology that constrains the solder reflow allows for very fine-pitch bumping. The copper pillar serves the added purpose of increasing the bump's standoff and meets the 80 to 90 µm height necessary for good reliability and consistent underfilling.