Unitive to Install 300 mm Bumping Line

10/01/2002

RESEARCH TRIANGLE PARK, N.C. — Unitive announced its intent to install a 300 mm production line and support for electroplated wafer bumping and WLP. The line, which will be installed at the Hsinchu, Taiwan facility of Unitive Inc.'s affiliated company UST, is a joint venture with the Semiconductor Equipment Consortium for Advanced Packaging (SECAP). The Company plans to support volume production in the first quarter of 2003 subject to final installation and qualification.

Equipment suppliers within SECAP, including newest member NEXX Systems, will participate in the line by installing their most current 300 mm equipment. Unitive will invest in equipment, ancillary support equipment and infrastructure to support the line.