Wafer handling partnership for Adept and DEK

07/01/2002

SAN JOSE, CALIF. - Adept Technology and DEK have announced a partnership to develop a fully automated wafer handling system for DEK's screen printer wafer bumping and ball placement system. The system will provide an automated feeding solution that is compliant with SMEMA and SEMI standards.

Along with the DEK partnership, Adept also announced a full family of wafer handling systems. The products are SMEMA compatible and support wafer sizes up to 300 mm, as well as thinned wafers. The system can be expanded and reprogrammed for use as a back-end cluster tool by adding option wafer interfaces for reflow ovens or other process equipment.