AP Award Program Sees Another Successful Year
09/01/2003
Innovation again took center stage at Advanced Packaging's 2003 Advanced Packaging Awards Ceremony, held July 16 in conjunction with SEMI and the back-end portion of SEMICON West.
In a full to capacity crowd, 14 companies were honored for their innovative contributions to the semiconductor packaging industry.
Now in its third year, the Advanced Packaging Awards program is an annual celebration of product excellence in semiconductor packaging. Premier products based on the finest examples of creative advancement in technology in 14 key areas are chosen by a distinguished panel of judges composed of industry experts and academia members.
It is said that to be successful requires diligence, innovation and a dedication to excellence. The winning companies — each of the entering companies, truth be told — certainly displayed these characteristics with an array of technologically advanced products and services. The following pages of this special insert are dedicated to these companies and their continuous quest to advance the packaging industry.
SEMI President and CEO Stanley Meyers was a guest speaker at the awards, and he summed up best the goal of the award program: "The clever minds behind the companies and organizations in the semiconductor industry will always come through with that great new product, process or service that contributes to a gain in productivity, a cost saving, a competitive benefit, or makes possible a new killer application that consumers embrace." This is what makes our industry unique and successful, and this is what the program applauds. See the adjacent page to read more about Meyers' thoughts on the importance of innovation in the packaging industry.
The Advanced Packaging Awards program was created to recognize the positive advancement of semiconductor packaging technology. As such, both small and large companies share equal opportunity. Each submission is judged based on its ability to meet a significant industry challenge; creative application of a new or existing technology; overall quality and consistency of performance; economic merits; and throughput characteristics. Specifically, each submission is judged on its innovativeness, cost effectiveness, speed and throughput improvements; quality contribution; ease of use; maintainability or repairability; and environmental responsibility.
In today's economy, it is key to continue looking ahead, not back. The industry still needs those smaller, faster, cheaper applications that will keep us at the forefront of excellence. And that is where the Advanced Packaging Awards program comes in — recognizing those companies that meet these challenges. Judging from the number of awards displayed on the show floor the day after the ceremony, many companies are up to meeting the challenge.
Congratulations again to the 2003 Advanced Packaging Award winners,
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John Bubello
Advanced Packaging Publisher