New Products
10/01/2004
Epoxy Mold Compound
 |
A semiconductor packaging material, Hysol GR9810 is an epoxy molding compound for SiP-on-laminate applications. The compound is for use as an overmold on various laminated-based molded array packages, including SiP and flip chip array packages that have been underfilled conventionally. The product's flat nature allows all the package to be processed in a non-warped state, minimizing subsequent manufacturing steps, and potentially resulting in higher end-of-the-line yields. The epoxy mold features numerous characteristics, including ultra-low warpage, the ability to underfill small ICs and passive components and adhesion to various laminate substrates. Also, the compound is non-antimony/non-bromine/non-phosphorous, and is capable of reaching JEDEC Level II requirements (substrate dependent) at 260°C reflow temperature. Henkel Loctite Corp., Industry, Calif., www.loctite.com.
Wafer Backgrinding System
 |
3M wafer support system is designed for ultra-thin wafer backgrinding, and is an alternate to the conventional tape process for backgrinding. Capable of producing wafers as thin as 20 µm, the system's approach enables semiconductor manufacturers to use existing grinding equipment to produce thinner wafers at faster grinding speeds, and with increased yields. The support system's equipment includes a wafer mounter to attach the wafer to the glass plate with liquid adhesive, a wafer demounter to separate the glass and adhesive from the wafer after the backgrinding process and a glass cleaner/coater. It also includes consumable materials: ultra-clean UV curable spin-on adhesive and a light-to-heat conversion coating. This layer allows the adhesive to separate from the glass after the backgrinding process. 3M Electronics Markets Materials Div., 3M, St. Paul, Minn., www.3M.com.
Platform-based Placement Machine
 |
Genesis Lightning combines the throughput of the company's rotary Lightning head with the flexibility and component handling range of the Genesis platform. Each Lightning head features a radial array of 30 modular, individually controlled spindles. With two heads on the Genesis platform, the configuration can drive placement rates to 54,000 cph. It also supports component pre-orientation and on-the-head rejection for small parts, increasing throughput and productivity. The platform offers various enhancements that maintain commonality with other company platform equipment. Enhancements include improved feeder interfaces that feature three-point mountings; a new Magellan camera system that offers a wider field of view and higher resolution; multi-color/angle illumination that optimizes fiducial capture; and a dual-drive linear motor positioning mechanism that delivers positioning speed accuracy. Universal Instruments Corp., Binghamton, N.Y., www.uic.com.
Backside Wafer Processing
 |
The company developed a high-throughput backside wafer coating process, hosted on a mass imaging platform, and capable of surpassing the ±12.5-µm total thickness variation (TVV) required by many wafer processing specialists. The process is compatible with underfill or adhesive-type coatings, typically applied at 50-µm thickness to the backside of semiconductor wafers, preceding singulation. Also, the process is compatible with the company's metal stencil and emulsion screen technologies. Metal stencils allows materials with larger filler particles to be applied with a smooth surface finish, while mesh stencils enable other materials to be deposited accurately at high speed. The capabilities of both the machine and the stencil technology achieve control over the print thickness, ensuring uniformity at high production volumes. DEK International GmbH, Zurich, Switzerland, www.dek.com.
Online Dicing Blade Selection Software
Hub blade online software designed for faster and simpler blade selection has been introduced. Using Blade PRO software, process engineers can enter supply-specific manufacturing process parameters and required blade features to identify the best blade for the highest productivity and yield. The Web-based software is available free to the company's blade customers, and will be updated constantly with new blade data. Benefits of the online software include that customers can design and generate samples from personal computers, and they can access the Blade PRO account from any computer with an Internet connection. The software processes any customer data, including copper, low-k dielectric and higher I/O densities, to automatically select the best performing blade to allow for higher dicing throughput. Kulicke & Soffa Industries Inc., Willow Grove, Pa., www.kns.com.
Jetting
This company developed an improved method for applying solder ball reinforcement material to semiconductor packages that can eliminate the need for dispensing secondary underfill in PCB assembly. Using this method, DispenseJet DJ-9000 shoots a fluid stream of underfill adhesives as small as 100 µm wide between the balls on CSPs and other BGA packages during the semiconductor packaging process. Jetting the underfill prior to board assembly without contaminating the solder balls results in packages with improved reliability without the cost of traditional underfilling. Asymtek, Carlsbad, Calif., www.asymtek.com.
Macrodefect Inspection System
 |
WaferView 320 Turbot macrodefect inspection system can improve yields by offering ultra-high throughput inspection of the front, back and edge of wafers for lithography issues, and can provide manufacturers the opportunity to rework and recover more wafers before undergoing irreversible processing steps. Each of the dual inspection modules can scan independently and simultaneously the front surface of a 300-mm wafer for defects 20 µm and larger in approximately 30 sec. The system's ReviewScope drives to the defect location identified by an i-Mod system for efficient analysis, eliminating transportation and queuing delays between separate standalone inspection and review tools that typically can exceed 30 min. with 300-mm automation. It also can create and optimize inspection recipes for i-Mod systems, allowing track equipment to run interrupted, and to serve as a backup tool during i-Mod maintenance. Rudolph Technologies Inc., Flanders, N.J., www.rudolphtech.com.
Flip Chip Bonder
A high-speed flip chip bonder, FCX501 is designed for the mass production of high-frequency electronics devices. The system is capable of ultrasonic and thermosonic flip chip bonding processes that create a nonmetallic bond with high thermal and electrical conductivity. The system can handle various interconnect technologies and die/substrate combinations. Additional benefits include 3,600 uph throughput, 0.5- to 10-mm-sq. die size and a small footprint. Panasonic Factory Automation, Elgin, Ill., www.panasonicfa.com.