New Products
08/01/2004
Test Socket Interconnect Technology
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A photolithographic package test technology, Quatrix was developed as an alternative to traditional contactor methods using spring pins for test sockets. As a single plane of contacts with no moving parts, the process-based technology offers repeatable dimensional placement tolerance in conjunction with good electrical performances to meet most package test roadmaps. The sockets feature lower touchdown force between the contacts and the package to eliminate issues associated with the high combined forces encountered in high pin count applications for chips with high-density I/O. Kulicke & Soffa Industries Inc., Willow Grove, Pa., www.kns.com.
Wafer Bumping Solder Paste
A low-void wafer bumping solder paste formula, SE-CURE 7501 features good printing as well as stable performance to 70-µm pitches for a consistent printing process. The printing performance provides overall bump height consistency across the wafer as well as from wafer to wafer. The paste is engineered to facilitate a low-cost bumping method while enabling a high-quality end product. As part of statistical development, the product achieves void rates below 10 percent independent of bump pitch. The product features various benefits, including consistent printing over a typical manufacturing shift and removal of post-reflow residues with standard bumping strip chemistries. The paste is available in Sn63/Pb37, as well as in low alpha and ultra-low alpha emitting Sn63/Pb37. Kester, Des Plaines, Ill., www.kester.com and FlipChip International (FCI), Phoenix, Ariz., www.flipchip.com.
Reworkable Underfill Encapsulant
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CN-1453 is a reworkable BGA underfill encapsulant that is a silica-filled version of the company's CN-1432. Featuring a lower coefficient of thermal expansion (45 ppm/°C, as opposed to 70 ppm/°C), the product is intended for demanding applications. The material features a viscosity of 7,500 cps at room temperature. The encapsulant is fast flowing, capable of flowing 18 mm with a single-side dispense, in a minimum of 20 seconds. Reportedly exhibiting good wetting, the material self-fillets, eliminating the need for seal passes to create complete and symmetrical fillets. Post-reflow, the encapsulant can be cured in five minutes in an in-line oven at 165°C. Zymet Inc., East Hanover, N.J., www.zymet.com.
Dry Photoresist Technology
An offering for semiconductor packaging, WB series dry photoresist is for wafer bumping. The photoresist is an alternative for wafer bumping vs. liquid resists. The thick, dry photoresist (from 50 to more than 100 µm) is applied in a single step with no solvents or drying required. The result is fewer overall process steps, and precise thickness uniformity from edge to edge of the wafer is achieved, regardless of the wafer size being produced. A range of dry photoresist thicknesses and formulations are available for use in lead-free, photostencil and standard electroplating applications. DuPont Electronics Technologies, Research Triangle Park, N.C., www.dupont.com.
Metal-matrix Composite
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AlSiC (aluminum silicon carbide) is a metal-matrix composite that provides high-performance lids, or heat spreaders, to the flip chip IC packaging market. The composite enables a tailored coefficient of thermal expansion, offering compatibility with numerous electronics devices and assemblies. The composite can be tuned for specific applications by modifying the Al-metal/SiC-particulate ratio. The product also features a high thermal conductivity that results in efficient thermal dissipation. The conductivity prevents the bowing and flexing of packaging and substrate material that can lead to failure. The net-shape fabrication process produces the composite material as well as fabricating the product geometry, allowing for fast prototyping of high-volume advanced thermal management solutions. CPS Corp., Chartley, Mass., www.alsic.com.
Turnkey Solution Expansion
This company expanded its integrated turnkey solutions with design for test (DFT) capabilities that are designed to improve device testability and throughput for a lower cost of test and faster time to market. As part of the increased capabilities, the company is providing consultation and technical training to spread knowledge of DFT and various DFT techniques, including scan insertion and automatic test pattern generation, built-in-self-test and boundary scan, and mixed signal. During the initial design stage, consultation will be available on DFT implementation, selection of DFT techniques for optimizing test efficiency and reducing test vector set. At the test stage, customers will be informed on test design, verification, vector generation and test program creation. The company's test technologists also will help customers test devices with DFT features, debugging, and tracing and modifying test vectors on a design to enhance test engineering. ST Assembly Test Services Ltd. (STATS), Singapore, www.stts.com.
3-D Modeling Software
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Featuring 3-D modeling options for semiconductor and MEMS processes, MEMulator 2004 is a software tool for fabrication process emulation and visualization. The tool creates 3-D models by adding cross sectioning, animation and numerous usability enhancements. The software allows users to model complex semiconductor fabrication steps in high-definition detail, and applies volume element, pixel type visualization to semiconductor process applications. The tool automatically can create virtual prototype models from a single die to an entire wafer. It supports applications in surface micromachining, bulk micromachining and wafer bonding. Micro-assembly processes, scripting, visualization and optional meshing capabilities also are offered. The software is available for Windows 2000 and XP platforms. Conventor Inc., Cary, N.C., www.conventor.com.
Silicon Wafer Dicing Capability
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A 6" GaAs and silicon wafer handling and dicing capability is available for the IX-300 ChromaDice UV-DPSS laser wafer dicing system. The system now is offered with an upgraded air bearing stage that provides higher speed and acceleration, in addition to greater travel for up to 6" wafers. The system also is available with either 355- or 266-nm high-power, short pulse UV lasers for high-speed, high-yield processing of sapphire, silicon and GaAs wafers, as well as other materials. An upgraded laser diode wafer detector is available for all wafer types on the upgraded system. The detector module interfaces with the new motion control system and allows any type of wafer up to 6" to be processed on standard dicing tape frames without damaging the dicing tape, thereby allowing breaking and stretching for pick-and-place die transfer. The wafer detector allows partial wafers to be processes as well, with no tape damage. J.P. Sercel Associates (JPSA Laser), Hollis, N.H., www.jpsalaser.com.
Microtest Systems
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Model 5848 MicroTester is for testing microelectronic devices, MEMS, photonic and other small components. The tester provides precise load and displacement measurement capability, as well as cyclic performance. Applications include semiconductor die shear-and-pull tests, tensile testing of fine wires, flex testing of circuit boards and substrates, and peel tests of thin films and substrates. The system features a load capacity of 2 kN, and provides the submicron position measurement accuracy and ultra-high-precision load and position control capability necessary for static testing microcomponents. The tester's design includes a rigid frame, capable of either horizontal or vertical orientations, that ensures accurate and repeatable deformation measurements. Mounted directly on the loading actuator, an encoder provides position measurement resolution of more than 20 nm. Instron, Canton, Mass., www.instron.com/pr.
Digital Bus Switches
Eight NanoSwitch digital bus switch products have been introduced to address operational requirements of next-generation servers, high-performance networking/telecom backplanes and more. The P13CH family of low-voltage, high-bandwidth bus switches offers expanded performance capabilities that meet the needs of advanced performance communication buses. The switches are said to offer numerous features, including: flat on-resistance (5 Ω — flat) across the full device bandwidth, low on/off capacitance (5 to 10 pF) that enables the switches to be used in applications to reduce bus loading, high signal passing bandwidth, beyond rail-to-rail switching, 5 V I/O tolerant with 3.3 V supply and more. Pericom Semiconductor Corp., San Jose, Calif., www.pericom.com.
High-performance Flux
A dulling flux technology, ALPHA EF-9301 is compatible with both tin/lead and lead-free processes and helps manufacturers meet environmental regulations without sacrificing productivity. The flux delivers good yield and throughput with the reliability of a medium solids rosin flux. Under real-world test conditions, the material delivered higher first pass yields, more throughputs and required less rework than competitive materials. The flux reduces bridging on connectors and bottom-side components and provides hole filling. It also minimizes solder balling, which reduces board-handling time. The material creates smooth, fully dull solder joints, easing the visual inspection process. Cookson Electronics Assembly Materials, a Cookson Electronics Co., Jersey City, N.J., www.alphametals.com.
Electronic Sensor System
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Tactilus is an electronic sensor system that enables the precise mapping and measurement of force distribution between any two contacting or mating surfaces in real-time. The system measures contact pressures from 0.007 to 14.10 kg/cm2. Because the sensor is thin, flexible, durable and customizable, it is adept at analyzing pressure distribution in the actual wafer bonding process as well as in examining proper polishing head contact pressures. The system can be used for single- or multi-spindle heads, and within the sensor is a thin, flexible skin that is packed densely with numerous sensing points. These points can be as close as 1 mm apart and can collect data up to 65,000 points per second. The sensor skin has a minimum thickness of 0.8 mm, allowing adaptation over curved surfaces or in invasive intolerant environments. Sensor Products Inc., East Hanover, N.J., www.sensorprod.com.
Probe Station Addition
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The 4060 analytical probe station is available with the FA-2000, an emission microscope system. The probe station features high stability and precision, and was developed for use with the emission microscope. The four-point platen support, X-Y-range microscope bridge, fast platen lift control and microscope uplock make the station and microscope a good fit for test laboratories. The emission microscope system provides simple, powerful, integrated software with full-function math and analysis tools. The system also offers spectral sensitivity and quantum efficiency, reliable construction, and pixel binning. The Micromanipulator Co., Carson City, Nev., www.micromanipulator.com.
Weighing Systems
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Designed with variable capacitance technology, Checkweigher is an electronic counting and weighing scale. The system offers high accuracy and internal resolution for weighing and counting. It provides up to 1 million internal increments for precision in small parts counting, and up to 500,000 user-selectable displayed increments for accurate measurement. Designed for material handling, inventory control and packaging applications, users select a target weight or count for filling operations and enter the over/under tolerance. The system automatically signals the operator when the load is in range. The system is available in a range of load capacities, including 2, 5, 12, 16, 25, 30 and 50 kg. It features a readability of 0.5 and 1.0 g, and a database that allows long-term storage up to 1,800 part numbers with their associated low, target and average piece weight. It also provides lot number, tare weight, and total count and set points. Setra Systems Inc. Weighing Systems Div., Boxborough, Mass., www.setra.com.
Singulated Packaging Process
Techniques for performing mass imaging processes on singulated substrates directly from the process carrier are engineered to streamline singulated package assembly and achieve the advantages of mass imaging without moving substrates into a designated carrier. Electronics materials can be applied to singulated substrates individually lifted from the carrier. Substrates enter the printer in the customer's chosen process carrier. Upon reaching the board stop, the carrier is held in place by the machine's snugger rail system as the first substrate is aligned. The machine's camera system verifies correct alignment before the substrate contacts the stencil by standard vacuum tooling. After mass imaging, the substrate is lowered into the carrier. The board stop then allows the carrier to move to the next position where the second substrate is aligned and the cycle repeated. After each substrate has been processed and returned to the carrier, the carrier moves directly to the next downstream process. The process allows package assemblers greater flexibility than can be achieved with dispensing techniques. DEK International GmbH, Zurich, Switzerland, www.dek.com.