Issue



Coming Soon in 3D


09/01/2007







Ultratech, San Jose, CA


1. It was a picture-perfect July day to visit Ultratech’s San Jose, CA, campus, world headquarters for the North America-based OEM. Left to right: Françoise von Trapp, managing editor, Advanced Packaging; Laura Rebouché,V.P. investor relations, corporate and marketing communications, Ultratech; Richard Mahany, V.P. of manufacturing; Diane Donnelly, national sales manager, Advanced Packaging; Manish Ranjan, director of product marketing; and Gail Flower, editor-in-chief, Advanced Packaging.
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2. Ultratech’s laser processing tools are built in bays in the laser tool manufacturing facility. Here, customers can run sample processes to qualify the tools to their specifications.
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3. Donnelly, Flower, and von Trapp model the latest in cleanroom fashion - color-coded to differentiate visitors from staff engineers.
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4. The tools are modular, broken down to the front-end module, the stepper, and the electronics module.
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5. Mahany demonstrated the intricate optics of the dual-side vision alignment system. Optics project light down to the reticle, where the image is taken and copied onto the wafer in a step and repeat process through the bottom of the lens.
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6. The back-end of the machine houses the electronics.
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7. Mahany describes the stage area as housing the sensitive parts of the mechanism.
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Synova, Fremont, CA


1. Synova’s Fremont team hosted the Roadshow crew at the company’s West Coast micromachining center (MMC). Left to right: Akos Spiegel, applications manager; Adam Greenberg, applications manager; Flower; Notker Kling, general manager, Synova North America; and von Trapp.
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2. The LDS 300 laser dicing system is designed for back-end processes such as dicing, edge grinding, thinning, hole drilling, slotting, grooving, inking, isolating, and marking. Guided by the micro water jet, a green laser is used to dice a wafer without thermal damage, eliminating microcracks, oxidation, and low die-fracture strength.
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3. Greenberg explains how an LED illuminates the workpiece by penetrating through the waterjet and reflecting off the series of mirrors.
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4. Greenberg shows us an actual coupling unit to further illustrate his diagram.
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5. Kling shows Flower and von Trapp the precision cuts LMJ can perform for medical applications.
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6. Sample wafer shows how laser dicing does not have to occur in straight lines, and different-size die can be cut from the same wafer.
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Rogers Corporation, Rogers, CT


1. Rogers invited us to tour their newly renovated materials research facility at their world headquarters in Rogers, CT. Left to right, back row: Dirk Baars, director, advanced materials group, Rogers; and Scott Kennedy, senior development engineer, Rogers. Front row: Nancy Larson, marketing communications manager, Rogers; von Trapp; Bob Collopy, digital media manager, Advanced Packaging; Flower; Robert C. Daigle, V.P. research and development, CTO, Rogers.
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2. Joe Kliwinski and Chris Riel, operators, demonstrate the pilot coating line with its four zone flotation oven as it coats 12-µm thick-film dielectric with multiple materials.
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3. John Reynolds, senior engineering assistant, explains how he uses an Agilent network analyzer to characterize electrical properties.
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4. Murali Sethumadhaven, Ph.D, group leader for new business development, talks about Rogers’ non-silicone, zero-contact-resistance TIM, recently licensed from IBM.
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5. Amie Tworzydlo, engineering assistant, calculates thermal resistance and conductivity of the company’s non-silicone thermal grease using an Analysis Tech TIM tester.
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6. A Thermo-Electron X-ray attachment to the JEOL scanning electron microscope (SEM) camera is used as a research tool to check the consistency of aluminum (Al) and silicon (SiC) in the AlSiC composite. The green area correlates to the presence of SiC and the red area correlates to the presence of Al.
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