Welcome to Nerdvana!

04/01/2007

Vectron International, Hudson, NH

We had a great turnout for our visit to Vectron International, in Hudson, NH. (L-R) Lin Wang, director of product management, Jacob Li, director of engineering, Vectron; Chris Platt, group publisher; Francoise von Trapp, managing editor; Bob Collopy; digital media sales manager; Diane Donnelly, national sales manager; Gail Flower, editor-in-chief; Daniel S. Stevens, Ph.D. CTO, Vectron; Meredith Courtemanche, assistant editor; and Tom Cunneen, VP, sensors and advanced packaging, Vectron. Click here to enlarge image

null

Suited up for the class 100 cleanroom, it’s hard to tell who is who. (L to R) Collopy, Courtemanche, von Trapp, Donnelly, Flower, and Li. Click here to enlarge image

null

Diane Kimball, layout technician, guides us through the SAW (singulated acoustic wave) process of wash/dry/mask. After the wash process, the crystals are loaded into mask frames and go into nitrogen cabinets. Click here to enlarge image

null

The masks are transferred to the evaporator for metal deposition using shadow masking technique.Click here to enlarge image

null

The Docksis Module is a surface mountable, two-sided, FR-4 based package that integrates more functionality into transmitting telephone data.Click here to enlarge image

null

Click here to enlarge image

null

Reichl B. Haskell, engineering manager for Sensor Element Technologies, explains his work in the test lab with custom packaging solutions for extreme environment viscosity sensors. Click here to enlarge image

null

Viscosity sensors have a scratch-resistant diamond coating and a quartz sensor transducer on one side, and proprietary coatings on the backside in a gold leadframe package.Click here to enlarge image

null

J.P. Sercel Associates invited us to celebrate the move to their 35,000 sq. ft. facility in Manchester, NH. (L-R) Jeffrey Sercel, president, JPSA; von Trapp; Courtemanche; Flower; Donnelly; Rick Slagle, sales and marketing director; and Mike Martel, MMC Inc., media relations for JPSA.Click here to enlarge image

null

The JPSA founding triad: Patrick Sercel, Jeffrey Sercel, and Randy Hill gave us a tour of the demo lab where final test and evaluation is done. Click here to enlarge image

null

JPSA’s sub-assemblies are modular, allowing systems - regardless if they are diode pump solid state (DPSS) or eximer - to be built faster at lower cost. Click here to enlarge image

null

The DPSS laser system’s fine beam is best suited for dicing and scribing processes, and features differentiated motion control with magnetic motors, and a granite assembly for stability. Click here to enlarge image

null

The eximer laser system is suited for lithographic patterning of sensors because it exposes a larger area. It features selective material removal using photo-ablasion. Click here to enlarge image

null

Sercel demonstrates the safety feature on the JPSA system cabinet. When the door is open, the system shuts down, to eliminate risk of “welder’s burn.”Click here to enlarge image

null

Henkel’s focus was on the materials used throughout the electronics assembly process. L-R, back row: Dan Maslyk, application engineer; George Carson; Ph.D., technical director, applications engineering; front row: von Trapp; Jocelyne Bricker, marketing coordinator; Douglass Dixon, global marketing and communications manager; Elaine Yee, marketing specialist; Donnelly; Flower. Click here to enlarge image

null

Daniel Lobdell, applications engineer, demonstrates how a wafer is mounted on a carrier frame. Lobdell also demonstrated the wafer dicing process on a Disco saw. Click here to enlarge image

null

After reflow, rinsing with deionized water in the ACCEL Microcel system removes flux residueClick here to enlarge image

null

Click here to enlarge image

null

This Universal Advantis was used to pick-and-place the flip chip, as well as dip it in Multicore tacky flux. Click here to enlarge image

null

At the wire bond station, Jeremy Alonte, applications engineer, is checking for bleed out of materials over the wire bond and checking the integrity of the bond. Click here to enlarge image

Next, the flip chip is underfilled with Hysol FP4581 using an Asymtek system fitted with and auger pump dispense head. Click here to enlarge image

During the molding process, A Lauffer Model LHMS 28M simultaneously melts the Hysol GR9810-1 mold compound and uses thermocompression to seal the components into place. The packages are then ready for singulation using the same dicing saw fitted with a different blade. Click here to enlarge image

null