In Uncharted Territory

01/01/2007

1. Touring the NEXX System facilities are, from left to right, Gail Flower, editor-in-chief; Stan Piekos, VP finance; Meredith Courtemanche, assistant editor; Arthur Keigler, VP technology; Diane Donnelly, AP national sales manager; Dick Post, CEO; and Françoise von Trapp, managing editor. Click here to enlarge image

null

2. The wafer loader on this Stratus 300 can handle both 200- and 300-mm wafers simultaneously.Click here to enlarge image

null

3. John Harrell, systems engineer for the Stratus electrodeposition tool, demonstrates the wafer holder and how it is placed in the plating cell.Click here to enlarge image

null

4. Kyle Martin, assembly technician, really “gets into” his work assembling the Stratus tool.Click here to enlarge image

null

5. Shown here loading 300-mm wafers into the Nimbus, the front end of this tool can be converted in less than two hours to handle 150- or 300-mm wafers.Click here to enlarge image

null

6. Matt Dorogi explains how the wafers travel through the system on a tray for robust handling. Performance is same or better than that of a cluster tool process.Click here to enlarge image

null

1. The Roadshow crew, pictured here with our SemiGear hosts. Left to right: Françoise von Trapp; Diane Donnelly; Jian Zhang, Ph.D., president; Real Taschereau, Sr. manufacturing engineer; Chungsin Lee, CEO; and Gail Flower. Click here to enlarge image

null

2. A picture is worth a thousand words. Lee takes the time to illustrate a point to Flower. Click here to enlarge image

null

3. Zhang demonstrates the software interface for the Geneva tool. Click here to enlarge image

null

4. We got to see close-up how applying vacuum during the reflow process removes surface tension, resulting in fewer voids.Click here to enlarge image

null

5. Keith Saltmarsh, applications engineer, inspects a FOUP before installation.Click here to enlarge image

null

1. Enjoying the view from SEZ are, (left to right) Nicole Bräuer-Bertelsen, corporate administration; Christoph Hübner, manager, global marketing; Gail Flower; Johann Bylek, AP European sales manager; and Michael Roth, corporate marketing. Click here to enlarge image

null

2. SEZ has grown so rapidly that their influence and size caused the city of Villach to name the street with all of their plants “SEZ - Strasse.”Click here to enlarge image

null

3. Employees and guests enjoy a mid-day coffee and soda in the employees’ café.Click here to enlarge image

null

4. A solid chuck patented by SEZ is used to support thinned wafers needed for current packaging styles. Trainer Michael Hametner teaches customers and employees about each working part of the machines in a classroom-like setting. Click here to enlarge image

null

5. This solid chuck supports the wafer during cleaning.Click here to enlarge image

null

6. Dieter Bergner, senior technical instructor; and Ernst Gaulhofer, senior VP, advanced process management, go over the Esanti’s single-wafer wet platform. Notice the standard mechanical interface (SMIF) orange-colored pod for holding wafers and keeping them free of contamination.Click here to enlarge image

null

7. Kurt Lackenbucher, executive VP & COO, SEZ Group, backs up Gail Flower and Johann Bylek as he invites us to come in and talk to the staff at SEZ.Click here to enlarge image

null