Issue

Project 2000, a public relations program geared toward educating the industry on the benefits of hybrid circuit design technology, was spear-headed shortly after a Microelectronics Marketing Research Council speaker challenged the members of the International Society

When I was first introduced to the semiconductor packaging industry, my colleagues educated me about interconnection technologies - gave me a crash course on ICs and PCBs, and loaded me down with jargon

s packages become smaller and more powerful, the need for effective thermal management becomes paramount. A package that effectively dissipates heat stays cooler, functions better and is ultimately more reliable

The SK and SV Series radial leaded capacitors are said to be low equivalent series resistance (ESR) solutions for a variety of power-supply challenges

Five pizza companies - Andy's, Bebe's, Cassidy's, Denzy's and Elsie's - submitted 5 pizzas each, with toppings of pepperoni, bologna, cheese, anchovies and pineapple, for the Annual Best Pizza Contest held in Pizza Bay

In this column I will briefly review some of the common techniques used to cool electronic modules in vehicles and some specific requirements that currently limit their use

Time-to-market is indisputably the key issue facing the semiconductor industry. In the midst of the Internet revolution, opportunities abound for those semiconductor companies that can provide rapid solutions to these new-world demands

Solder bumping is a crucial step in the assembly of high-density packages because it provides an interconnecting medium. A successful solder-bumping operation requires that close attention be paid to the electroless-nickel and solder-paste-printing processes

New design tools promise to relieve setup bottlenecks by automating the documentation and validation work

New computer interface and multi-head dispenser makes adhesive dispensing both versatile and reliable

An enhancement of BGA technology meets the challenges of long life, extreme thermal and mechanical conditions, the use of large components, and the need for ultra-high reliability

Examining the factors involved in choosing an AXI system for the post-reflow testing of soldered connections.