Table of Contents
Solid State Technology
Year 2000
Issue 6
 | FEATURES
Step By Step
Step 6: Lead forming
Since the advent of surface mount technology (SMT), chip designers have benefited from the doubling of the amount of available board real estate and ever-developing means of assembly and packaging
New Innovations In Dispe
New innovations in dispensing liquid encapsulants
A viable alternative to transfer molding for fine-pitch advanced IC packages gains acceptance. A dual chamber driven by an LPD pump provides continuous dispensing for maximum equipment usage.
Partners In Manufacturin
Partners in Manufacturing: Increasing performance and speed with wafer bumping
Wafer-level processing provides effective solutions to demanding requirements.
The New Challenges In Di
The new challenges in die attach
Addressing the flexibility and complexity of accommodating new package technologies on a single machine, while also improving accuracy.
What You See Is What You
What you see is what you get
Finding patterns and reporting their location quickly and accurately is essential in today's high-precision electronics and semiconductor manufacturing environments.
Controlling The Paramete
Controlling the parameters that affect heat dissipation during burn-in
Considerations, calculations and cautions regarding heat sinks and thermal interfaces.
Emerging Trends Drive Ev
Emerging trends drive evolution of underfill dispensing
New technologies provide solid process capabilities for a variety of interconnect strategies.
Stacked Multi Chip Csp S
Stacked multi-chip CSP standards
JEDEC has propelled stacked chip-scale package standardization efforts in the form of a common agreement on SRAM and flash chips in a single package.
The Telecom Tool Kit.htm
The telecom tool kit
Six process tools enable packaging of high-frequency products.
Flip Chip Packaging Reli
Flip-chip packaging reliability advances
A high-performance chip carrier provides a robust, complete, optimized flip-chip carrier solution.
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DEPARTMENTS
Think Tank
The School Break
"I know that you wanted only 10, 100, 10K and 100K Ohm resistors for your school project (SP), but I bought a box that contains more than the quantities you need, as well as several resistors of other values," said Tom's dad
New Products
New Products
The Flexplacer's direct drive X- and Y-axis linear encoders control head travel and 100-percent touchless combined laser/vision centering on all components
Feature Products
Semicon West PRODUCT ROUNDUP
At long last, it is time again for Semicon West. The conference and exhibition, which feature technical sessions and various assembly, test and packaging booths, will be held in San Jose, Calif., July 12-14
News
Intarsia advances RF design with seamless simulation
As electronic products increase in functionality, the true challenge lies in maintaining outlines that are equivalent to or smaller than their predecessors
Editorial
Christmas in July
Every summer in Chicago, there's a special occasion called Christmas in July - a non-secular event during which companies and individuals donate their time to volunteer in their communities
Notes From The Floor
Floor Semicon West 2000
It's that time of year again when we all have Semicon West on our minds or agendas. We are anxiously waiting to see the latest and greatest in semiconductor manufacturing - specifically as it relates to packaging, assembly and test
Automotive Perspective
Who's winning the pitch war - ICs or substrates?
In today's state-of-the-art designs, an interconnect war is being fought between the input/output (I/O) pitch of semiconductors and the substrates/packages to which they are connected
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