Table of Contents
Solid State Technology
Year 2000
Issue 4
 | DEPARTMENTS
Feature Products
Mixing System
With the External Mix system, two-part, structural acrylic adhesives can be thoroughly blended and applied without the use of static mix nozzles. An adhesive is blended as it is applied to the bonding surface, ensuring that two adhesive parts fully mix upon clamping. With this system, adhesives cure at room temperature, achieve handling strength in less than 60 seconds and fill gaps up to 0.1 inch. The system is designed for bonding magnets and metallic substrates.
Feature Products
Fiberglass Repair Epoxy
Tra-Bond 5126 is a medium-viscosity, two-part adhesive for use as a bonding material for thermally ablative insulation substrates to aerodynamic surfaces in many aerospace applications. The product is a room temperature curable epoxy that contains no solvents and can be easily applied with a brush, trowel, roller or silk screening. It offers reliable bonds to phenolic plastics, polyester and epoxy laminates, glass, hardboard, and most metals. The epoxy is a good electrical insulator and withstan
Feature Products
Curing Lamp
The Luxor visible light, fiberoptic spot lamp cures adhesives through substrates that absorb UV light and allows for greater depth of cure than traditional UV-light curing. The high-intensity light source (>100 mw/cm2) can be used with advanced, single pack, UV- and visible-light-cure adhesives in optoelectronics, fiberoptics, lens bonding and other microassembly applications. The lamp cures adhesives with a 460 nm visible blue light. The fixture features a cool fiber tip, no need for warm-up be
Feature Products
Fast Curing and Flame Retardant Epoxy
Insulbond 865 is a fast setting 1:1 mix epoxy adhesive system that is suited for electronics, product assembly and aircraft applications where automatic dispensing of a fast curing flame retardant epoxy adhesive is necessary. The product is strong and flexible, and will bond to a variety of substrates, including most plastics, metals, ceramics, paper, wood and rubber materials. Characteristics include shear strength of 8,500 psi, one year shelf life at room temperature, 400 volt/mil dielectric s
Feature Products
Solventless Epoxies
Epoxies thinned with solvents may weaken performance, separating into a liquid phase during curing, in turn leaving bubbles that weaken the bond or downgrade electronic and thermal performance. Metech has announced new epoxies that are solventless. They are compounded with reactive diluents incorporated into the film during the curing process. PCD 40073 is a fast-cure, thermally conductive, insulating epoxy for application on a wide range of substrates, including ceramics, glass, phenolic, epoxy
Feature Products
High Performance Epoxies
Aremco Products has announced a new and expanded technical bulletin (Technical Bulletin A7) that describes the company`s entire line of high-performance epoxy systems. The bulletin addresses Aremco Products` range of both single and two-part systems. Entitled "High Performance Epoxies," the bulletin includes detailed technical specifications. Epoxies are divided into four categories: ultra-high temperature systems (filled and unfilled systems for applications up to 600°F); high temperatu
Feature Products
Epoxy Compound
Supreme 3HTND-2 is a no-mix, one-component rigid-curing epoxy compound for high-performance glob-top applications. Said to cure quickly at moderately elevated temperatures, the compound does not require refrigeration and has a shelf life in excess of six months at ambient temperatures. The product, with flow properties reportedly tailored for glob-top application, is said to feature high-physical-strength properties and resistance to thermal shock. It is 100-percent reactive and does not contain
Feature Products
Electrically Conductive Adhesive
Epo-Tek EE165-3 is a silver-filled, electrically conductive adhesive designed as a solder replacement for SMT, hybrid microelectronics and other electronic assembly applications. The product provides the electrical and physical stability of a solder joint and is a viable low-risk, lead-free alternative for SMT joining applications, such as mounting passive components, chips and plastic packages to PCBs. Its low process temperature makes it a good candidate for flex circuits and temperature-sensi
Feature Products
Rubber Masterbatches
Kelprox XL is a new line of EPDM-based rubber masterbatches to be used by plastic and rubber compounders to produce thermoplastic elastomers. It is said to provide compounders with a route to produce thermoplastic vulcanizate (TPV) compounds for a variety of elastomer applications. The masterbatches reportedly eliminate the requirement for compounders to develop complex vulcanization technology. The products are crosslinked, so no additional vulcanization is required. Using this material as the
Feature Products
Flip-chip Underfill
ME-526 is a one-component, high-purity, fast-cure, semiconductor-grade epoxy system developed for the underfill encapsulation of flip-chip devices. It can cure in 15 minutes at 165°C and does not require two-step curing to minimize stress. This material was designed to reduce stress between the substrate and the solder bumps by keeping the solder bumps in a constant state of compression. The product reportedly has a low viscosity and rapidly flows under devices with standoffs down to 0.001
Feature Products
High-temperature Masking Tape
Scapa 557 is a low-static pressure-sensitive silicone adhesive film designed to mask and protect gold finger contacts on PCBs during high-temperature wave soldering and hot air leveling processes. This polyimide film can eliminate PCB degradation because of electrostatic discharge. The product is thin and conformable, and can mask uneven surfaces. According to the company, it can withstand operating temperatures up to 500°F, and removes cleanly, even after prolonged exposure to heat and che
Feature Products
Primerless Silicone Adhesives
A line of thermally conductive adhesives can be used for applications, such as bonding hybrid IC components to substrates and securing heat sinks. These one- and two-part silicones produce durable, low-stress elastomers and provide good primerless adhesion to a variety of substrates, including ceramics, epoxy laminate boards, reactive metals and filled plastics. Dow Corning`s thermally conductive adhesives generally offer long working times and produce no corrosive or harmful byproducts during c
Feature Products
Thermally Conductive Epoxy
Loctite 3861 is a low-viscosity, thermally conductive epoxy potting compound for electronic casting and encapsulating applications that require thermal conductivity and chemical resistance. This heat-curable potting material offers low thermal expansion, good wetting and flow capabilities, good thermal shock resistance, high heat transfer capabilities and good electrical properties. When fully cured, the product is resistant to weather, water, gases and vapors, petroleum lubricants, and mild aci
Feature Products
Screen-printable Ink
120-07 is a screen-printable, electrically conductive ink, coating and adhesive that is conductive even when cured at low temperatures. It is suitable for stamping, screen printing, dipping and syringe dispensing. Applications include polymer thick film circuitry, EMI/RFI shielding of polyimide flexible circuits, membrane switches and anode coatings for tantalum capacitors. Curing temperatures range from 50 to 150°C.
Feature Products
Conductive Gold Preparations
A line of conductive gold preparations in different viscosity ranges is available for application as electrically conductive paints, adhesives and thixotropic inks. They may be applied by brushing, spatula or screen-printing methods on substrate materials, such as paper-phenolic, glass-epoxy, polyester, glass, ceramic and metal. The preparations may be air-dried at an ambient temperature (80 to 120°C) for 15 to 30 minutes or fired at 850 to 950°C, depending on the substrate material. T
Feature Products
Die Attach Adhesives
ZipCure can be cured on the pre-heat stage of wire bonders, eliminating the need for oven curing without compromising adhesion, stability or reliability. Its epoxy siloxane chemistry provides low moisture absorption, which prevents popcorning. Repeated exposure to extreme humidity at elevated temperatures throughout a device`s life will not degrade the adhesive`s initial properties, including its high bond strength.
Feature Products
Film Adhesives
ESP8680-WL and ZEF8150-WL adhesive films are dry to touch and can be stored in ambient temperatures for more than 12 months. They require minimal pressure using a wafer/frame film applicator or heated rubber roll laminator to achieve void-free tacking of film adhesive onto wafer at 80 to 100°C. Once die is placed and tacked onto the substrate, the assembly may be post-cured without pressure, much like traditional die-attach adhesives. The films are self-supporting continuous film without fi
New Products
Plasma Etching System
The PE-2000R roll-to-roll plasma etching system is capable of processing various types of polymeric materials with varying width, thickness and substrate composition. The web type transport handles widths of 1 to 24 in. with average throughputs ranging from 100 to 300 feet per hour, depending upon residence time requirements. The system is computer controlled and password protected for repeatability of process and documentation of production cycles.
New Products
Linear Encoder
The RGH25-UHV linear encoder can withstand an extended 120°C bake-out process before being used in UHV chambers with pressures as low as 10-10 Torr. It is capable of speeds to 5m/sec, and combines with a self-adhesive, cut-to-length steel tape scale to provide resolution to 0.1 micron. The readhead measures 36 x 14.3 x 12.5 mm and weighs 22g. The readhead has a low rate of outgassing and a clean residual gas analysis. The encoder is available with either digital or analog outputs, and the o
New Products
Water-soluble Solder Paste
The water-soluble R560 solder paste was designed to reduce voiding in BGA solder connections. It will not break down under high or low humidity conditions, and it demonstrates repeatable performance regardless of changes in the printing environment. The product has a shelf life of one month (at room temperature) and is compatible with enclosed print head systems.
Feature Products
Epoxy
The Emcast 1790 family of delayed-action UV-curable epoxy products is designed to allow two opaque parts to be glued together using a UV adhesive. These products can be used for small-assembly projects and laminations. The adhesive is applied and irradiated with longwave UV light (325 to 380 nm), then, depending on formulation, UV intensity and duration, the surface-skin cure is delayed by seconds or minutes. A short heat post-cure after the parts are mated reportedly will hasten the final cure.
Feature Products
Adhesive Selection Guide
This 208-page guide, the second edition of the Mixpac Adhesive Selection Guide, contains hundreds of acrylic, epoxy, silicone and urethane adhesives organized by manufacturer and adhesive type. All adhesives are available to ship without preparation or lead time. The guide reportedly contains a table of industrial expertise that helps users find formulators with experience in specific industries. Substrate grids detail which adhesives are useful with different materials, and the glossary include
Feature Products
UV-curable Adhesive
MRC 03-1186 is a single-component, UV-curable adhesive developed for applications where strong plastic-to-plastic bonds are required. It was specifically designed for bonding polycarbonate and polymethylmethacrylate together or to metal substrates. The adhesive is said to exhibit the following properties: 75 to 85 Shore-D durometer, bonds to plastics such as PC and PMMA, UV cure in 10 to 15 seconds at 35 mW/cm2, low shrinkage, and no mixing.
Feature Products
Optically Clear Adhesives
ARclear adhesives are optically clear pressure-sensitive adhesive (PSA) technologies for the display-screen industry. Assembly of touch screens and FPDs require a number of component surfaces to be bonded in a secure manner without compromising display resolution and functionality. These adhesives are said to offer defect-free technology that does not require curing, which is an alternative to liquid adhesives. They come in either transfer-adhesive or custom-coated film format. FPD-bonding appli
New Products
PC-based Board Tester
The TracerMDA provides sophisticated in-circuit test capabilities, accurately and reliably measuring board level resistors, capacitors, inductors, diodes, transistors and IC clamping diodes. According to the company, the system can detect assembly failures, such as SMT opens, missing components, shorts, open traces, solder bridges and improperly inserted components with minimal programming time and maximum throughput. The test head control module plugs into any industry standard PC; the main sys
New Products
3-D and 2-D Microscope
The Combizoom 400 microscope integrates a two lens objective shuttle with a 1:12 zoom stereomicroscope, creating an effective zoom range from 10x to 350x magnification with a free working distance of 30 mm. The product provides both macro 3-D and micro 2-D inspection, and its stand comes with both coaxial fiberoptic illumination and oblique fiberoptic side lighting. Customer specifications can be accommodated.
New Products
PTFE Coatings
Calfornia Fine Wire offers polytetraflouroethylene (PTFE) coatings that can be enameled to almost all of its 1,000 metals and alloys. A proprietary process applies liquified PTFE to fine wires in continuous lengths of up to 10,000 feet. The wire is then run through a furnace to set the coating. The coating is said to be a good insulator, with a dielectric strength of 5,000 volts.
New Products
Stylus Profilers
The Dektak Series V line of stylus profilers can automatically access the entire surface of substrates up to 400 mm (16-in.) square, such as PCBs and flat panel displays. The positioning stage is capable of handling heavy samples, such as CMP plates and precision-machined parts. The profilers can perform long scans for measuring substrate flatness or planarity, as well as surface roughness measurements with high horizontal resolution.
New Products
Kitting System
The Partfolio is a portable kitting system designed to securely store and protect a wide range of sensitive components against loss and ESD/EMI damage. It is portable, easy to set up and prevents parts from migrating when closed. Parts managers load each kit with the precise number of components before the assembly process; the system`s 50 bins allow customization for a broad range of part sizes.
New Products
Surface Height Mapper
The NanoMapper metrology tool provides whole wafer topology data for 200-mm and 300-mm wafer sizes using non-contact optical measurement to quantify nanometer scale surface height variations. It responds to process development needs for leading-edge semiconductor devices down to 0.1 micron. Tracking the phase of the optical signal using proprietary interferometric technology results in the sub-nanometer resolution of the measurement.
New Products
Cleanroom Ionization System
The Gemini low-voltage cleanroom ionization system provides performance and control through individually addressable ceiling emitter modules. Ion output and balance can be adjusted using either a system controller or a hand-held infrared remote control. Once installed, the system is said to maintain proper ion output and coverage for extended periods of time and is designed to be easily installed in most cleanroom ceilings. Aerodynamically designed to minimize turbulence in unidirectional airflo
News
Quad Systems Corp., Willow Grove, Pa., has appointed Ted Shoneck to chief executive officer.
News
ViTechnology LLC, Haverhill, Mass., has appointed Holly Roche to sales coordinator for automated optical inspection systems.
News
Addison, Ill.-based PCT Automation Systems Corp. has promoted H. Paul Hickman to president, Brian Harstine to chief operating officer and James Wersching to director of sales.
News
Entegris Inc., Chaska, Minn., has promoted Michael Wright to senior vice president of corporate marketing.
News
Semiconductor Equipment and Materials International, Tokyo, Japan, has named Hidehiko Katoh director of worldwide flat panel display operations.
News
International Rectifier, El Segundo, Calif., has opened a North American automotive sales office at 26200 Town Center Drive, Suite 265, Novi, MI 48375; tel: 248-347-1830.
News
onQ Technology, Austin, Texas, has opened a 15,000 square foot manufacturing and customer support facility in the Philippines to provide back-end packaging services.
News
ScanCAD International Inc., Morrison, Colo., and JD Photo-Tools have announced a distributor agreement to sell ScanCAD programming and inspection workstations in the UK.
News
Techcon Systems Inc. has relocated its corporate headquarters from Carson, Calif., to a 50,800 square foot facility at 12151 Monarch Street, Garden Grove, Calif. 92841; tel: 714-799-9910.
News
To better reflect the current nature of its business, Sunnyvale, Calif.-based Transition Technology International and its manufacturing division
To better reflect the current nature of its business, Sunnyvale, Calif.-based Transition Technology International and its manufacturing division, Silicon 2000, have changed their names to TTI Silicon. The company has also leased an additional 10,000 square feet of manufacturing space at its Vancouver, Wash., site.
Editorial
The springtime swirl
As springtime activities spin around us, everyone at Advanced Packaging magazine is squeezing in time to dash off to the dry cleaners, pack suitcases and make last-minute limo reservations for the litany of upcoming shows we plan to attend. By the time this issue goes to press, we will have just completed trips to NEPCON West, APEX 2000 and IMAPS` International Symposium on Advanced Packaging Materials. We certainly understand the importance of getting away from our desks and talking with reader
Notes From The Floor
K&S gets serious...about saws
For years, Kulicke & Soffa has been the market leader in wire bond technology. From time to time, companies from Japan and Switzerland challenge its market share or technology position but, in the long run, K&S has come out on top. While the company has dabbled in other assembly equipment products, such as die bonders, dicing saws and autolines, its main focus and most effective resources were always applied to the wire bond product sector. Some have joked that if the equipment didn`t have a "W"
New Products
Manual Conditioner
The benchtop Dana MLCS-1, with a footprint of 10 x 10 in., can recondition packages with 0.5-mm pitch (.020-in.) in less than 90 seconds, restoring lead pitch, sweep, standoff and coplanarity per Jedec standards. The part is clamped into a holding nest and the operator moves a gearshift-like lever through short guided strokes to process the component one side at a time. The leads are oscillated left and right, and then they are combed, while up and down movement simultaneously occurs to correct
New Products
Dispensing Needles
Easy Release custom dispensing needles are designed for precise, repeatable application of encapsulation and underfill material. Encapsulation needles feature the standard conically chamfered tip that ensures complete transfer of material from the needle to the substrate or package. Underfill needles feature a "relieved" tip that allows the needle to be adjacent to the chip for better wicking action. Needles are available in 11 to 30 gauge in .250- to .350-in. lengths.
News
Combo Memory agreement
APack Technologies Inc., the first wafer bumping and flip chip foundry service provider in Taiwan, signed a memorandum of understanding (MOU) with Itochu Corp., Linvex Finet Japan and Siix Corp. for joint development and promotion of Combo Memory to the worldwide market. The Combo Memory module stacks SRAM and flash memory components to fulfill the small form-factor requirement of wireless communication handsets. According to the MOU, APack will provide its packaging design and manufacturing kno
News
ECTC meets in Las Vegas
The Electronic Components and Technology Conference (ECTC) will celebrate its 50th anniversary May 21-24 at Caesar`s Palace in Las Vegas. The conference is expected to attract more than 800 designers, engineers and technical managers from the packaging, components and materials segments of the electronics industry. The meeting features more than 300 technical papers, short courses, a review of educational programs and initiatives in packaging, and a technology corner featuring exhibits by leadin
News
Micronic sues Etec Systems
Micronic Laser Systems AB has commenced a court action in a U.S. federal court against Etec Systems Inc. Micronic filed the litigation against Etec, a competitor of Micronic in the market for laser pattern generation equipment, in response to statements by Etec allegedly purporting to indicate that Micronic may be infringing certain Etec U.S. patents. Micronic`s action alleges that Micronic does not infringe the patents in question and that Etec`s patents may be invalid.
News
IBM tops speeds on computer circuits
IBM Research has announced breakthrough results in developing a family of experimental high-speed computer circuits that run at test speeds up to five times faster than today`s top chips. The new circuits employ an innovative design called Interlocked Pipelined CMOS (complementary metal oxide semiconductor) to reach speeds of 3.3 to 4.5 billion cycles per second (3.3 to 4.5 GHz) using conventional silicon transistors, while dramatically reducing power consumption. IBM researchers estimate that c
News
Driver IC shortage to hurt Taiwan?
TAIPEI - Prices of thin-film transistor liquid-crystal displays (TFT-LCDs) have been rising since the third quarter of 1999 due to a severe shortage, according to Nikkei Business reports. The price increases have prompted TFT-LCD makers in Japan, Korea and Taiwan to expand operations, which in turn has resulted in a paucity of key components. The shortage of driver integrated circuits (ICs) will affect Taiwan manufacturers` expansion plans in 2000, according to market analysts.
News
SMTA International 2000 comes to Chicago
NORWALK, CONN. - The Surface Mount Technology Association (SMTA) is moving its flagship technical conference, SMTA International 2000, to the Rosemont Convention Center near Chicago. The show will take place September 24-28. Assembly Technology Expo will also relocate to the Rosemont Convention Center and will be held September 26-28.
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