Issue

did not fancy the idea of going to "Nowhere City," a place that was not even marked on the map, on a road that had no name. However, as I was driving along, I noticed the mile posts alongside the road

The Recipients of The 2001 Advanced Packaging Awards

The SEZ Group (Villach, Austria) has hired Paul Selinger as its new chief information officer

In November of 1998, I wrote about a market decline that was largely fueled by dynamic growth rates in 1996 and 1997. With these growth rates having significantly exceeded the average, it was inevitable that a correction would be required in 1998

Nearly every manufacturing company today has resources and budgets assigned to examine future designs of existing products, or to develop new products for existing and new markets

To help you prepare for the upcoming 34th International Symposium on Microelectronics (October 7-11, 2001, at the Baltimore Convention Center), Advanced Packaging has compiled a sampling of products that will be featured at the exhibition

Though Toshiba once had the smallest logic device in a two-billion unit market ($400 to 500 million), Texas Instruments (TI) has taken the competitive lead by introducing the NanoStar Little Logic - the smallest single-gate logic family available

IMAPS flip chip event targets an eager audience

There were certainly signs of the industry downturn at SEMICON West - modest social events, fewer nifty give-aways at the booths, less foreign traffic perhaps - but the atmosphere was generally upbeat

Moving from California to New Hampshire has been an educational experience. The move, prompted recently by the opportunity to join the Advanced Packaging staff, gave me the chance to learn, among other things, that our family's possessions weigh 9.7 tons

Improving mechanical properties by adding carbon fibers

Driven by growth of the worldwide wireless revolution, electronics component manufacturers are increasingly being faced with new challenges when it comes to reliably producing high-performance radio frequency (RF) devices in large quantities

Advances in die attach change the face of assembly

An SoC alternative offers miniaturization, enhanced electrical performance and greater interconnect density