Issue



Table of Contents

Solid State Technology

Year 2001
Issue 1

FEATURES

Step By Step


Step 1: The back-end process

During the past 30 years, dicing systems and blades have been continuously improved to address process challenges and accommodate the requirements of different types of substrates


Improving Flip Chip Manu


Improving flip-chip manufacturing through proper cleaning

Incorporating cleaning into the manufacturing process can increase throughput, performance and yield


Challenges And Trends In


Challenges and trends in back-end inspection and tray-to-tape packaging

Emphasis has shifted from upstream processes to optimization of back-end operations for BGA packages


Csp Devices On Printed W


CSP devices on printed wiring boards

Second-level reliability characterization using temperature cycling


DEPARTMENTS

News


Motorola innovates packaging with new strategies

Motorola Semiconductor Products Sector (SPS) is the strong, silent type. The industry might characterize the company as having been elusive in terms of its packaging developments in recent years, but behind this silence comes some good news for the packaging arena


News


Movers and shakers

Ferro Electronic Materials, a division of Ferro Corp., Vista, Calif., appointed Robert S. Hodder, Jr. as North American sales manager, East region


News


Briefly speaking

Advanced Interconnect Technologies (AIT) now offers a new Web site at www.aitsales.com. The site includes company and product information, reports and data sheets, assembly and test capabilities


News


Advanced Packaging launches Asia edition

NASHUA, N.H., AND Taipei, TAIWAN - PennWell Publishing and Arco Publishing have recently launched a Chinese/English language edition of Advanced Packaging magazine


Product Roundups


APEX Product Preview

The second annual IPC SMEMA Council Electronics Assembly Process Exhibition and Conference (APEX) will be held at the San Diego Convention Center, January 14-18, 2001


Think Tank


Alice and Her Daughters

One day recently, out of the blue, my sister Alice made this remark about her three daughters and herself


Notes From The Floor


Market outlook 2001

There are a variety of factors indicating that 2001 could be an interesting year for forecasting. PC sales are down and so is the communications market


Industry Voices


Breaking the solder barrier

As the electronics manufacturing industry moves into a new century, it finds itself searching to create a more environmentally friendly manufacturing environment


New Products


New Products

Laser Height Sensor
The new CCD noncontact laser height sensor for the Millennium Series M-2000 system is said to provide high-speed dispense height measurement for delicate substrates, hybrids and ICs that may be compromised by tactile sensing


Editorial


Kicking off 2001

Beginning a new year always conjures up all sorts of resolutions... organizing your desk (because it might be condemned by the local fire marshal)...eating the "right" foods (we'll bypass the whole dieting thing altogether)...maybe even setting aside more savings (so we can retire sooner?)