Issue

SCHÄRDING, AUSTRIA — EV Group (EVG), a manufacturer of various wafer processing equipment, completed another equipment purchase agreement with XinTec Inc. of Taiwan.

Electronics packaging materials suppliers traditionally have functioned as developers of continuously evolving formulations that enhance both component and assembly performance and reliability.

Here we are at the end of 2002, at pretty much the same point we were at the end of 2001?having survived a very difficult year and assuming/hoping that business would be better by about the middle of the following year.

Microelectromechanical systems (MEMS) technology quickly made the transition from innovative concepts to practical demonstrations and on to early products.

The editors of Advanced Packaging and Solid State Technology magazines conducted an exclusive survey of key figures in the semiconductor manufacturing industry. We gathered input on two critical areas of front and backend convergence ? WLP and chip/package co-design. Following is what the industry experts had to say.

Predicting voids and unbalanced mold flow

Changes affecting the semiconductor supply chain

Revisiting An Old Packaging Approach