Table of Contents
Solid State Technology
Year 2002 Issue 12
![](https://sst.semiconductor-digest.com/wp-content/uploads/magazines/print/issues/ap1112_cover.jpg) | DEPARTMENTS
Think Tank Think Tank
News XinTec Expands Shellcase CSP Technology
SCHÄRDING, AUSTRIA — EV Group (EVG), a manufacturer of various wafer processing equipment, completed another equipment purchase agreement with XinTec Inc. of Taiwan.
The Changing Role Of The The Changing Role of the Materials Supplier
Electronics packaging materials suppliers traditionally have functioned as developers of continuously evolving formulations that enhance both component and assembly performance and reliability.
Editorial The Year of Living Dangerously
Here we are at the end of 2002, at pretty much the same point we were at the end of 2001?having survived a very difficult year and assuming/hoping that business would be better by about the middle of the following year.
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FEATURES
Special Report Wafer Lev Wafer-scale Encapsulation: Controlling MEMS Packaging Costs
Microelectromechanical systems (MEMS) technology quickly made the transition from innovative concepts to practical demonstrations and on to early products.
Special Report Wafer Lev Industry experts speak on WLP and co-design
The editors of Advanced Packaging and Solid State Technology magazines conducted an exclusive survey of key figures in the semiconductor manufacturing industry. We gathered input on two critical areas of front and backend convergence ? WLP and chip/package co-design. Following is what the industry experts had to say.
Molding Simulation.html Molding Simulation
Predicting voids and unbalanced mold flow
Quality System Requireme Quality System Requirements
Changes affecting the semiconductor supply chain
Hot Bottomceramic Packag
Revisiting An Old Packaging Approach
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