Issue

Stephan H. Schmidt, general manager, has been elected to the LPKF Laser & Electronics USA (Wilsonville, Ore.) board of directors.

The FXS-160.40 inspection system is designed for off-axis inspection of planar devices

The final numbers for the revenue generated by assembly equipment sales in 2001 are in, and the results are not pretty

Pisctaway, N.J. - The Components, Packaging and Manufacturing Technology Society (CPMT) of the IEEE recently announced the winners of its annual awards for technical excellence, achievement, leadership and service.

The Optical Fiber Conference (OFC) in Anaheim in March included announcements of many new packaging technologies and products

For 1,001 nights, the princess related stories to the sultan. At the end of this time, the sultan said, "Do you know the number of nights that we had musicians entertaining us at dinner?"

In the very first issue of Advanced Packaging, thermal management was probably the biggest topic

The importance of thermal management to Intel's microprocessors was demonstrated by the prominence given to a recent announcement about heat sink technology

Dow Chemical Co. announced the addition of five new members to its SiLKnet Alliance, a collaboration working to create products and processes for low-k dielectric materials

IMAPS held its first International Conference on Advanced Packaging and Systems (ICAPS) in March in Reno

In an effort to leverage the production capabilities and growing markets in China, many companies are forming partnerships or opening new facilities there. Recent announcements include

While putting together our 10th anniversary issue, it was great fun to look through old issues of Advanced Packaging to see what has changed and what hasn't in the past decade

Flip chip is a technology where semiconductor devices are mounted and electrically connected face-down directly onto substrates

A key enabler for low-cost SoC and SiP

Advanced shear tools for gold ball bonds

Thermal management for broadband component assembly

The role and status of the packaging, assembly and test subcontractor has steadily increased over time