Issue

Table of Contents Solid State Technology Year 2002 Issue 4	DEPARTMENTS News Plexus licenses Tessera technology Plexus Corp., an electronic manufacturing services (EMS) provider, will be licensing Tessera's chip scale packaging (CSP) and multichip packaging (MCP) technology News Bluetooth progress facilitated by ASE's fine pitch technology Advanced Semiconductor Engineering (ASE) is working with Cambridge Silicon Radio (CSR) to build its next generation Bluetooth chip News Progress on thin wafer handling There has been much progress in the past year on wafer thinning, with portable electronics providing the driving force for thin die News New system automates thermal measurements Netzsch Instruments introduced a new line of flash diffusivity instruments for measurement of thermal properties, such as specific heat and thermal conductivity New Products SEMICON Europa Products Aluminium nitride ceramic heatsinks are ideal for passively cooled, high-powered laser diode modules and can be more thermally efficient than aluminium oxide components. Think Tank Squares Within Squares Mary wanted to plant tulips and marked out a 12 feet square area with four stakes at the corners, intending to prepare the bed later in the week Editorial Packaging industry leading the way A common topic of discussion on these pages and in the industry as a whole is the convergence of wafer processing and packaging technology News SECAP spreads the word with APiA launch SECAP, the Semiconductor Equipment Consortium for Advanced Packaging, is in its second year now with some interesting projects underway

FEATURES The Back End Process Ste The back-end process: Step 4 - Die attach Today's challenges In back-end semiconductor manufacturing, the die attach process is a critical step. In simple terms, die attach is picking a chip from a wafer and placing it onto a substrate or metal lead frame Plated Leadframe Metrolo Plated leadframe metrology Optical collimation improves capabilities for Au/Pd/Ni films Integrated Packaging And Integrated packaging and testing of optical MEMS Working toward fully integrated solutions Variable Frequency Micro Variable frequency microwave curing Advanced process finds optoelectronic applications Wafer Level Mems Packagi Wafer-level MEMS packaging Microelectromechanical systems (MEMS) contain fragile parts that require encapsulation in a hermetically sealed cavity for reasons of protection, reliability and tuning of performance 10th Anniversary Insight 10th Anniversary Insights A short history of wafer-level packaging There have been only a few fundamental shifts in the history of electronic packaging that changed the whole industry. One was the step from through-hole assembly to surface mount technology (SMT)

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