Issue

Many people in the semiconductor industry have been waiting until the first quarter of 2002 to try to get some idea of where the industry is headed

Liz and Brenda live on opposite sides of the street, where there are an equal number of houses on each side

Portland, MAINE - Intertech has set the agenda for its conference, "Cool Chips 2002 - Developing New Market, Material and Design Strategies for Thermal and Power Management," which will be held April 3-4 in Monterey, California

A group of seven companies have begun a collaboration to accelerate the commercial development of advanced packaging technologies, such as wafer-level packaging (WLP)

Motorola Semiconductor Products Sector (SPS) has developed and qualified the industry's first wafer-level burn-in and test (WLBT) process for high-performance flip chip microprocessors

The latest advance in the active area of wafer thinning was announced by ChipPAC

Optical interconnect has generated much interest over the years because of the performance benefits of transmitting signals at the speed of light rather than through copper wire or other solid conductors

Early this year I met with a number of packaging sub-contractors, and one theme that came up at virtually every one of them is the increasing importance of test in their business

As a result of decades of manufacturing flip chip packages, there exists a large database of reliability information about lead solder bumps

Calculation of phase diagrams for lead-free power IC die attach

Improving image quality in photosensitive polyimide films

Inspection requirements for wafer-level packaging processes

Many industry luminaries today debate what will be the interconnect technology of choice for semiconductor devices in the future