Table of Contents
Solid State Technology
Year 2003
Issue 1
 | DEPARTMENTS
Calendar Of 2003 Events.
Calendar of 2003 Events
News
DEK, Asymtek, JEOL Join APiA
DEK adds to APiA's roster its mass imaging systems, which can be used for wafer bumping, grid array population, encapsulation and underfilling.
Subcontractor Update Pos
Subcontractor Update: Positive Signs
Business has taken a distinct upturn in the last six months at the major assembly and test subcontractors.
New Products
New Products
Editorial
Minding Our Business
This year we are increasing the scope of our coverage of the packaging world by adding a focus on business issues.
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FEATURES
Multichip Packaging Busi
Multichip Packaging, Business and logistical issues
Continuing functional enhancement of portable consumer and computing products challenges electronics industry OEMs to provide these products in smaller and lighter form factors.
Solder Joint Failure Ana
Solder joint failure analysis
Solder joint integrity is of paramount importance for the reliability of an electronic package attached to a printed circuit board (PCB).
Die Bonding With Polyimi
Die bonding with polyimide tape
The reliability of a plastic package is reduced by the presence of bubbles, since moisture can accumulate there.
Device Level Packaging F
Device-level Packaging for Optical Integration
The fabrication of optoelectronic (OE) devices requires highly precise processing, as well as strategies for coping with 3-D structures unknown in conventional electronics packaging.
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