Issue



Table of Contents

Solid State Technology

Year 2004
Issue 9

DEPARTMENTS

New Products


New Products


Editorial Board


Software: Design Tool, Product Differentiator

"Software" is of course a very broad topic, but design and simulation is probably what comes to mind most often when the term is used in our industry.


Industry Voices


Cost Implications of Package Proliferation

Although the proliferation of semiconductor packages has been a part of the industry for the past 20 years, the last several years have seen the rate of proliferation accelerate.


Notable Developments


Exploring New Frontiers in Power- and Nano-Electronics

The Electronic Packaging Lab at the University at Buffalo has earned a reputation for its cutting-edge work in developing computational and experimental measurement tools for facilitating the development of the next-generation microelectronics packaging.


Advanced Packaging Award


Recognizing Excellence in Innovation

It is once again with great pleasure that Advanced Packaging Magazine congratulates the winners and participants of the 2004 Advanced Packaging Awards.


Advanced Packaging Award


2004 Advanced Packaging Awards


News


In the News


Editorial


When Companies Acquire Companies

There are lots of reasons why companies buy other companies.


FEATURES

Stud Bumping And Die Att


Stud Bumping and Die Attach for Expanded Flip Chip Applications

SUPPORT FOR TODAY'S EMERGING APPLICATIONS


Lead Free Solder Wafer B


Lead-free Solder Wafer Bumping

OVEN CONTROL AND SOLDER MATERIAL CONSISTENCY ARE CRITICAL


The Back End Process


Flux Inspection with UV Fluorescence AOI

Making the Invisible Visible


Optical Packaging.html


Optical Packaging

SILICON HOUSINGS CHANGE MANUFACTURE OF OPTICAL TRANSCEIVER SUBASSEMBLIES


Standard Open Tool Packa


Standard Open Tool Packages for MEMS-enabled Products

MEMS DESIGN SOFTWARE SPEEDS PRODUCTION


Cover Story


SiP Technology Offers Packaging Alternatives for Design

Integrating Technologies and Reducing Costs