Issue

Miniaturization, portability, cost and performance are the primary challenges in wireless systems.

Your competitor offers a new plastic-packaged assembly that can replace one of your main income-producing products at a price slightly higher than yours.

Many companies in electronics are moving operations to Asia with mixed results. Therefore, we spent time talking to a few in the back-end assembly side to see what precipitated their actions.

Although much of the buzz in the industry surrounds newer high-tech packages such as ball grid array (BGA), chip scale packages (CSP) and flip chips, the foundation of modern electronics is the lead frame package.

Ultraviolet (UV) laser micromachining of microelectromechanical systems (MEMS) and micro-optoelectromechanical systems (MOEMS) is emerging as a viable, and often preferable, alternative to wet processing and other methods, thanks to its speed, accuracy and simplicity.

More ICs are being used in tighter spaces and increasing numbers of ICs are approaching or exceeding their operating temperature limits.

Microelectromechanical systems (MEMS) are miniaturized systems with electrical and non-electrical components.

The microelectromechanical systems (MEMS) component market size is forecasted to continue growing over the next few years. This article presents design considerations to provide a better understanding of the unique challenges facing MEMS packaging engineers, when compared to traditional IC packaging. Automatic MEMS assembly requires optimized equipment and processes.