Those involved with the assembly and packaging end of semiconductor manufacturing are seeing a fundamental change in the role of a few suppliers who used to be lumped under the moniker "subcontractors."
In recent years, the exponential growth in semiconductor technology has been sustained by extending the capabilities of top-down manufacturing processes to smaller and smaller dimensions.
Underfill materials are used to increase the reliability of devices such as flip-chips, chip scale packages (CSPs), ball grid arrays (BGAs), micro BGAs and other components.
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