Issue

Table of Contents Solid State Technology Year 2005 Issue 8	DEPARTMENTS New Products SEMICON Taiwan 2005 Product Preview Editorial Board Semiconductor Assembly and Test Providers: The New Technology Frontier As device manufacturing continues down the path of smaller geometries and increased densities laid out by Moore’s law, the importance of packaging technology to the overall performance of the device continues to grow in parallel. Industry Voices Package-on-Package Space Savings with Flexibility Today’s consumer electronics demand higher performance from smaller form factors. Editorial A Look at IMAPS There are just so many tradeshows that you can attend each year, but if you have to choose just a few for back-end assembly, SEMICON West and IMAPS should be high on your list. News In the News

FEATURES The Back End Process Materials and Methods for IC Package Assemblies Packaging Design Review How Advances In Rf And R How Advances in RF and Radio SiP Affect Test Strategies Integration requires a high level of test coverage across SiPs Cover Story Innovations in IC Packaging Adhesives UV B-Stage Technology Provides Process & Performance Advantages

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