Issue

Table of Contents Solid State Technology Year 2005 Issue 5	DEPARTMENTS New Products New Products Editorial Board Is ‘Packaging’ a Valid Academic Subject? The answer is yes. First, we need to define ‘packaging. Editorial The SIA Takes a Stand on Nanotechnology Have you read the latest news from the Semiconductor Industry Association (SIA)? News In the News Industry Voices Packaging in the Nanotechnology Era Recent scientific breakthroughs in nanotechnology are anticipated to provide the most significant disruptive technologies since the Internet.

FEATURES The Back End Process Flip Chip Attach Alternatives Advances in Bump Technology 3 D Integration Of Ics.h 3-D Integration of ICs NEW PRODUCTION TECHNOLOGIES Mass Imaging Responds To Mass Imaging Responds to Wafer-Scale Packaging Advances WAFER BUMPING SOLUTION High Density Package Des High-density Package Design MEETING THE DEMAND Cover Story High-density Wafer Bumping with Solder Paste HIGHEST BUMP HEIGHT-TO-PITCH RATIO

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