Issue

Table of Contents Solid State Technology Year 2005 Issue 4	DEPARTMENTS Editorial The Latest in Packaging Research Every now and then, it’s especially good to step out of your normal activities and see what’s going on at other companies and universities. News In The News Industry Voices The ‘Other’ Tin Issue: Tin Pest Most IC packaging technologists are aware of this “other” issue, but this topic has never required serious consideration. Packaging Trends Subcontractor Update: Up in 2004, Uncertainty into 2005 The major assembly and test subcontractors ended 2004 with revenues up significantly over 2003, but with a slowing trend leading into 2005. New Products New Products Editorial Board Extreme-Environment Electronics for the Future Electronics have dramatically changed the way we live, conduct business, communicate, and educate.

FEATURES Evolution Of Organic Fli Evolution of Organic Flip Chip Packaging Packaging Technology Ready For Change The Back End Process Automating Hybrid Circuit Assembly Die Attach What Is Ic Package Co De What Is IC/Package Co-design? Enabling Global Optimization & Characterization of Design Cover Story Through-wafer Via Etching The technical challenges and the manufacturing complexity confronting conventional methods of increasing IC device density in 2-D are increasing at a high rate.

DEPARTMENTS