Issue



Table of Contents

Solid State Technology

Year 2005
Issue 2

DEPARTMENTS

Editorial Board


More Options for OEMs

OEMs have more options today regarding how to get their products to market on time, with the high quality and low cost that is now expected in the industry.


Editorial


Starting a New Year

I recently talked to many engineers and forecasters to see how this year has begun and what forces are at work.


Industry Voices


The ‘Lab-less’ Outsource Model

Everyone in the semiconductor industry is acutely aware of the tremendous benefits that the ‘outsourcing model’ has afforded our industry.


New Products


New Products


News


In the News


FEATURES

The Back End Process


Step 2: Stud Bump Bonding

Flip Chip Enabling Technology


Known Good Die A Closer


Known Good Die: A Closer Look

TEST METHODS AND RELIABILITY SCREENS


Underfill Effects On Bga


Underfill Effects on BGA Drop, Bend, and Thermal Cycle Tests

SIGNIFICANT PERFORMANCE IMPROVEMENTS


Wafer Level Microbumping


Wafer-level Microbumping for Flip Chips

A NEW BUMPING METHOD


3 D Partitioning Of Prin


3-D Partitioning of Printed Circuit Design

‘ELEVATED HIGHWAY BYPASS’ PACKAGING DESIGN