Issue

Table of Contents Solid State Technology Year 2005 Issue 2	DEPARTMENTS Editorial Board More Options for OEMs OEMs have more options today regarding how to get their products to market on time, with the high quality and low cost that is now expected in the industry. Editorial Starting a New Year I recently talked to many engineers and forecasters to see how this year has begun and what forces are at work. Industry Voices The ‘Lab-less’ Outsource Model Everyone in the semiconductor industry is acutely aware of the tremendous benefits that the ‘outsourcing model’ has afforded our industry. New Products New Products News In the News

FEATURES The Back End Process Step 2: Stud Bump Bonding Flip Chip Enabling Technology Known Good Die A Closer Known Good Die: A Closer Look TEST METHODS AND RELIABILITY SCREENS Underfill Effects On Bga Underfill Effects on BGA Drop, Bend, and Thermal Cycle Tests SIGNIFICANT PERFORMANCE IMPROVEMENTS Wafer Level Microbumping Wafer-level Microbumping for Flip Chips A NEW BUMPING METHOD 3 D Partitioning Of Prin 3-D Partitioning of Printed Circuit Design ‘ELEVATED HIGHWAY BYPASS’ PACKAGING DESIGN

DEPARTMENTS