Issue

MOUNTAIN VIEW, CA - To commemorate the 35th anniversary of the 4004 Intel microprocessor, the Computer History Museum and the Intel Museum hosted a night of history and discussion, November 13, 2006.

I like going to the IMAPS International Symposium, held this year Oct 9-14 in San Diego.

Maintaining the stability of moisture-sensitive electronic components and assemblies is a fundamental concern of manufacturers.

There is growing evidence that the RoHS directive banning lead solders in electronic equipment has fallen victim of the Law of Unintended Consequences.

It wasn’t exactly the Roadshow, but I visited a fascinating start-up company and spoke with Arthur Chait, CEO; and Anwar Mohammed, VP of manufacturing and operations, about EoPlex Technologies, headquartered in Redwood City, CA.

SEASIDE, OR - The third edition of Flexible Circuit Technology features new technologies and applications that have developed over the eight years since the second edition was published.

KALISPELL, MT - Through-silicon vias (TSVs) are pivotal in thermally conscious packaging, and a budding consortium pledges to address the technical and cost issues of creating 3-D interconnects using TSV technology for chip stacking and MEMS/sensors packaging.

AUSTIN, TX - Freescale Semiconductor announced they have shipped over 30 million high-power laterally diffused metal oxide semiconductor (LDMOS) radio frequency (RF) transistors in over-molded plastic packages.

SAN JOSE, CA - Hesse & Knipps, Inc., fully-owned subsidiary of German Hesse & Knipps GmbH Semiconductor, has appointed Guill Muyot as senior field service engineer.

It’s amazing how much you learn when you reach out to others. My father often told me figuring out what I would do with my life was a quandary to him.

Get your motor running, head out on the highway - looking for adventure, and whatever comes your way Gail Flower, editor-in-chief gets a ride from Dick Schedtler, VP AR Marketing.

Semiconductor assembly and packaging process engineers routinely face pressures of evolving technology requirements such as lead-free compliance, product introductions, and customer demands for quality.

MEMS is an enabling technology allowing for the development of smart products, augmenting the computational ability of microelectronics with the perception and control capabilities of microsensors and microactuators and expanding the space of possible designs and applications.

Tin is a common component of solders because of its desirable properties such as low melting point, high diffusivity, low surface tension in the liquid phase, and others.

Advanced 3-D packages are replacing leadframe packages with the emergence of more subsystem integration, strengthened by advances in wafer-level technology.

Surface preparation prior to metallurgical bonding ensures a strong intermetallic formation of soft solder and various surfaces.