Issue

The removable solid-state storage (RS3) market posted strong growth in 2005, as consumer demand for flash cards and universal serial bus (USB) flash drives continued.

SAN JOSE, CA - Further paving the way into the consumer optics arena, Tessera announced the first licensing agreement for their wafer-level image sensor packaging technology, Shellcase CF, to Flextronics International Ltd.

SHANGHAI, China - Verisilicon Holdings Co., Ltd., an ASIC design foundry, semiconductor library, and intellectual property (IP) provider, along with Semiconductor Manufacturing International Corporation (SMIC), will release a standard design platform (SDP) for 0.13-μm low-leakage processes.

MOUNTAIN VIEW, CA - Actel Europe announced the addition of Rouzbeh Hosseinalikhani as a field applications engineer (FAE) to its Nordic and Baltic regions support staff.

GOLDEN, CO - To build high-volume manufacturing facilities for its proprietary thin-film batteries, Infinite Power Solutions (IPS) attracted funding from existing and new corporate investors.

With the July 2006 deadline for the European Union’s (EU’s) RoHS and WEEE directives past, it’s interesting to observe the long-term impact of lead-free implementation upon X-ray inspection.

Bendable chips are a key component of future smart systems such as smart textile and flexible displays.

Dage’s computerized tomography (CT) option for digital X-ray inspection systems uses a digital geometric process to generate a 3-D image model from a series of individual 2-D X-ray image “slices” taken around a single axis of rotation.

TEMPE, AZ - Motorola Labs and Arizona State University (ASU) have co-developed a coating process that allows chemical-detecting peptides to alert single-walled carbon nanotubes (SWNTs) to the presence of heavy-metal ions at the parts-per-trillion level.

How often have we heard, “Nothing personal; I know it’s not right, but it is good business”? To that I say, “No way.

Our first stop in New York was to Endicott Interconnect, where we learned about organic build-up substrates.

SANTA CLARA, CA - In an overview of its restructuring plan for the long-term future, Intel detailed reductions in workforce, merchandising expenses, capital, and materials.

For High-performance Protection

Silicone adhesives have a wide array of applications in microelectronic products.

The miniaturization and increased functionality of electronic devices is causing manufacturers to seek new thermal management solutions.

Then and Now

Many companies experience extreme problems once their FPGAs get to the package level, not least of which is electrical noise.

As chip manufacturers drive to smaller device size follow the International Technology Roadmap for Semiconductors (ITRS), material challenges arise in every part of the manufacturing process.