Issue

Reactive bonding is a room-temperature process for soldering packages or components directly to boards without using a conventional solder reflow.

The AKU2000 surface-mountable complementary metal oxide semiconductor (CMOS) microelectromechanical systems (MEMS) microphone integrates an acoustic transducer, output amplifier, and 4th-order sigma-delta modulator in a single chip.

Package-on-package (PoP) has emerged asthe preferred 3-D packaging solution for integration of logic and high-performance memory devices in mobile multimedia products.

A typical phone call to a package manufacturer begins with: “I have this chip, what package do you have that will fit?” Next comes the basic questions: “What size is your chip? How many pads does it have? Does it need to be hermetic? Do you want it to be surface mountable? Leaded? Ball grid array? Oh, and by the way, how fast does your chip operate?” Depending on the answer to the last question, everything else becomes moot.

SAN JOSE, CA - In response to the success of Technology Innovations Showcase (TIS), SEMI has expanded the idea, introducing TechXPOTs to SEMICON West 2006, July 11-14 at the Moscone Center in San Francisco, CA.

Advanced Packaging thought it was time for a fresh look at what’s really happening in the semiconductor packaging industry, so we’ve hit the road.

Don’t you just love being right? It took a long time for flip chips to go mainstream, but now that they have made it, it’s very satisfying.

A stress-free alternative

From Current to Next-generation Materials

Dos and Don’ts of Wire-Bond Assembly

An Effective Wafer-Bumping Method

Wafer-level solutions for optical and sensor applications

Reducing Thermal Resistance at Die Level