Issue



Table of Contents

Solid State Technology

Year 2006
Issue 4

DEPARTMENTS

Editorial Board


Semiconductor Roadmap: The Bottom Line

The International Technology Roadmap for Semiconductors (ITRS) is the primary means for the semiconductor industry to move forward in some kind of orderly manner, with everyone looking at the same guideposts as they push technology ahead.


Industry Voices


Design for Yield - A Hot Term for an Old Concept

Achieving design for yield (DFY) has more to do with effectively managing the IC design process than it does with introducing a new generation of software tools.


Packaging Trends


Breaking Down the Barriers for True Innovation

Senior executives at semiconductor companies worldwide have an innovation crisis on their hands.


New Products


NEW PRODUCTS


Editorial


Sockets Power Up

Last week, I tried spring skiing in New England. I didn’t know if I’d remember all the necessary techniques.


News


In the News


FEATURES

The Back End Process


High-accuracy Mass Imaging for Semiconductor Die Attach

More Speed and More Control


Advanced Interconnect Co


Advanced Interconnect Comes of Age

Single-Cell Process Streamlines Bumping


Single Pass Assembly Of


Single-pass Assembly of SiPs

A Challenge to Multi-Chip Die Bonders


Inspecting Post Wire Bon


Inspecting Post Wire-bond Interconnects

An AOI Approach


Cover Story


Socket Technology Validates High-frequency Devices

A method was developed that allows a socket to be soldered in place of the package within the same footprint.


High Power Led Stud Bump


High-power LED Stud-bump Packaging

Delivering a Bright Future